SNOK011 September 2024 TLV3603-EP
(Note that qualification by similarity ("qualification family") per JEDEC JESD47 is allowed) | ||||
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Description | Condition | Sample Size (Allowed Rejects) | Lots Required | Test Method |
Electromigration | Maximum Recommended Operating Conditions | N/A | N/A | Per TI Design Rules |
Wire Bond Life | Maximum Recommended Operating Conditions | N/A | N/A | Per TI Design Rules |
Electrical Characterization | TI Data Sheet | 10 | 3 | N/A |
Electrostatic Discharge Sensitivity | HBM Per TI data sheet |
3 units/voltage | N/A | EIA/JESD22-A114 or ANSI/ESDA/JEDEC JS-001 |
CDM Per TI data sheet |
EIA/JESD22-C101 or ANSI/ESDA/JEDEC JS-002 | |||
Latch-up | Per Technology | 3(0) | 1 | EIA/JESD78 |
Physical Dimensions | TI Data Sheet | 5(0) | 1 | EIA/JESD22- B100 |
Thermal Impedance | Theta-JA on board | Per Pin-Package | N/A | EIA/JESD51 |
Bias Life Test | 125°C/1000 hours or equivalent | 45(0) | 3 | JESD22-A108(1) |
Biased Humidity | 85°C/85%/1000 hours | 77(0) | 3 | JESD22-A101(1) |
or | ||||
Biased HAST | 130°C/85%/96 hours or 110°C/85%/264 hours | JESD22-A110(1) | ||
Extended Biased Humidity | 85°C/85%/2000 hours | 77(0) | 1 | JESD22-A101(1) |
or | ||||
Extended Biased HAST | 130°C/85%/192 hours or 110°C/85%/528 hours | JESD22-A110(1) | ||
Unbiased HAST | 130°C/85%/96 hours or 110°C/85%/264 hours | 77(0) | 3 | JESD22-A.118(1) |
Temperature Cycle | -65°C to +150°C non-biased for 500 cycles | 77(0) | 3 | JESD22-A104(1) |
Solder Heat | 260°C for 10 seconds | 22(0) | 1 | JESD22-B106 |
Resistance to Solvents | Ink symbol only | 12(0) | 1 | JESD22-B107 |
Solderability | Bake Preconditioning | 22(0) | 1 | ANSI/J-STD-002 |
Flammability | Method A / Method B | 5(0) | 1 | UL94 |
Bond Shear | Per wire size | 5 units x 30(0) bonds | 3 | JESD22-B116 |
Bond Pull Strength | Per wire size | 5 units x 30(0) bonds | 3 | ASTM F-459 or TM2011 |
Die Shear | Per die size | 5(0) | 3 | TM 2019 |
High Temp Storage | 150°C / 1000 hours | 15(0) | 3 | JESD22-A103(1) |
Moisture Sensitivity | Surface Mount Only | 12 | 1 | J-STD-020(1) |