SNOK011 September   2024 TLV3603-EP

 

  1.   1
  2.   2
  3.   Qualification by Similarity (Qualification Family)
  4.   Enhanced Products New Device Qualification Matrix
  5.   5
  6.   Important Limitations on Use of Data Exceeding Specified Limits

Enhanced Products New Device Qualification Matrix

Table 1-1 Enhanced Products New Device Qualification Matrix
(Note that qualification by similarity ("qualification family") per JEDEC JESD47 is allowed)
Description Condition Sample Size (Allowed Rejects) Lots Required Test Method
Electromigration Maximum Recommended Operating Conditions N/A N/A Per TI Design Rules
Wire Bond Life Maximum Recommended Operating Conditions N/A N/A Per TI Design Rules
Electrical Characterization TI Data Sheet 10 3 N/A
Electrostatic Discharge Sensitivity HBM

Per TI data sheet

3 units/voltage N/A EIA/JESD22-A114 or ANSI/ESDA/JEDEC JS-001
CDM

Per TI data sheet

EIA/JESD22-C101 or ANSI/ESDA/JEDEC JS-002
Latch-up Per Technology 3(0) 1 EIA/JESD78
Physical Dimensions TI Data Sheet 5(0) 1 EIA/JESD22- B100
Thermal Impedance Theta-JA on board Per Pin-Package N/A EIA/JESD51
Bias Life Test 125°C/1000 hours or equivalent 45(0) 3 JESD22-A108(1)
Biased Humidity 85°C/85%/1000 hours 77(0) 3 JESD22-A101(1)
or
Biased HAST 130°C/85%/96 hours or 110°C/85%/264 hours JESD22-A110(1)
Extended Biased Humidity 85°C/85%/2000 hours 77(0) 1 JESD22-A101(1)
or
Extended Biased HAST 130°C/85%/192 hours or 110°C/85%/528 hours JESD22-A110(1)
Unbiased HAST 130°C/85%/96 hours or 110°C/85%/264 hours 77(0) 3 JESD22-A.118(1)
Temperature Cycle -65°C to +150°C non-biased for 500 cycles 77(0) 3 JESD22-A104(1)
Solder Heat 260°C for 10 seconds 22(0) 1 JESD22-B106
Resistance to Solvents Ink symbol only 12(0) 1 JESD22-B107
Solderability Bake Preconditioning 22(0) 1 ANSI/J-STD-002
Flammability Method A / Method B 5(0) 1 UL94
Bond Shear Per wire size 5 units x 30(0) bonds 3 JESD22-B116
Bond Pull Strength Per wire size 5 units x 30(0) bonds 3 ASTM F-459 or TM2011
Die Shear Per die size 5(0) 3 TM 2019
High Temp Storage 150°C / 1000 hours 15(0) 3 JESD22-A103(1)
Moisture Sensitivity Surface Mount Only 12 1 J-STD-020(1)
Precondition performed per JEDEC Std. 22, Method A112/A113