SNOSAQ2F July   2005  – August 2024 LMH6702QML-SP

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Quality Conformance Inspection
    4. 5.4 Electrical Characteristics: DC Parameters
    5. 5.5 Electrical Characteristics: AC Parameters
    6. 5.6 Electrical Characteristics: Drift Values Parameters
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Feedback Resistor
      2. 6.1.2 Harmonic Distortion
      3. 6.1.3 Capacitive Load Drive
      4. 6.1.4 DC Accuracy and Noise
    2. 6.2 Layout
      1. 6.2.1 Layout Guidelines
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

3 Description

The LMH6702QML-SP is a very wideband, dc-coupled, monolithic operational amplifier designed specifically for wide-dynamic-range systems requiring exceptional signal fidelity. Benefiting from TI's current-feedback architecture, the LMH6702QML-SP offers unity gain stability at exceptional speed without need for external compensation.

With a 720MHz bandwidth (AV = 2V/V, VO = 2VPP), 10-bit distortion levels through 60MHz (RL = 100Ω), 1.83nV/√Hz input-referred noise, and 12.5mA supply current, the LMH6702QML-SP is an excellent driver or buffer for high-speed flash analog-to-digital (A/D) and digital-to-analog (D/A) converters.

The LMH6702QML-SP benefits wide dynamic range systems, such as radar and communication receivers, that require a wideband amplifier offering exceptional signal purity. The low input-referred noise and low harmonic and intermodulation distortion make this device an excellent choice for high-speed applications.

The LMH6702QML-SP is constructed using TI's VIP10 complimentary bipolar process and TI's proven current-feedback architecture.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
LMH6702QML-SP NAB (CDIP, 8) 10.16mm × 7.87mm
NAC (CFP, 10) 9.91mm × 6.45mm
(1) For more information, see Section 9.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.

 

LMH6702QML-SP NAB Package, 8-Pin CDIP (Top View)NAB Package, 8-Pin CDIP (Top View)
LMH6702QML-SP NAC Package, 10-Pin CLGA (Top View)NAC Package, 10-Pin CLGA (Top View)