SNOSCZ4A April   2015  – October 2024 FDC1004-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Voltage Level
    7. 5.7 I2C Interface Timing
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 The Shield
      2. 6.3.2 The CAPDAC
      3. 6.3.3 Capacitive System Offset Calibration
      4. 6.3.4 Capacitive Gain Calibration
    4. 6.4 Device Functional Modes
      1. 6.4.1 Single Ended Measurement
      2. 6.4.2 Differential Measurement
    5. 6.5 Programming
      1. 6.5.1 Serial Bus Address
      2. 6.5.2 Read/Write Operations
      3. 6.5.3 Device Usage
        1. 6.5.3.1 Measurement Configuration
        2. 6.5.3.2 Triggering Measurements
        3. 6.5.3.3 Wait for Measurement Completion
        4. 6.5.3.4 Read of Measurement Result
    6. 6.6 Register Maps
      1. 6.6.1 Registers
        1. 6.6.1.1 Capacitive Measurement Registers
      2. 6.6.2 Measurement Registers
      3. 6.6.3 Measurement Configuration Registers
      4. 6.6.4 FDC Configuration Register
      5. 6.6.5 Offset Calibration Registers
      6. 6.6.6 Gain Calibration Registers
      7. 6.6.7 Manufacturer ID Register
      8. 6.6.8 Device ID Register
  8. 7 Applications and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Liquid Level Sensor
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Best Design Practices
    4. 7.4 Initialization Set Up
    5. 7.5 Power Supply Recommendations
    6. 7.6 Layout
      1. 7.6.1 Layout Guidelines
      2. 7.6.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.5 Electrical Characteristics

Over recommended operating temperature range, VDD = 3.3V, for TA = 25°C (unless otherwise noted). (1)
PARAMETERTEST CONDITIONMIN(2)TYP(3)MAX(2)UNIT
POWER SUPPLY
IDDSupply currentConversion mode; Digital input to VDD or GND750950µA
Standby; Digital input to VDD or GND2970µA
CAPACITIVE INPUT
ICRInput conversion range±15pF
COMAXMax input offset capacitanceper channel, Series resistance at CINn n=1.4 = 0 Ω100pF
RESEffective resolution (5)Sample rate = 100S/s (4)16bit
EONOutput noiseSample rate = 100S/s (4)33.2aF/√Hz
ERRAbsolute errorafter offset calibration±6fF
TcCOFFOffset deviation over temperature-40°C < T < 125°C46fF
GERRGain error0.2%
tcGGain drift vs temperature-40°C < T < 125°C-37.5ppm/°C
PSRRDC power supply rejection3V < VDD < 3.6V, single-ended mode (channel vs GND)13.6fF/V
CAPDAC
FRCAPDACFull-scale range96.9pF
TcCOFFCAPDACOffset drift vs temperature-40°C < T < 125°C30fF
EXCITATION
ƒFrequency25kHz
VACAC voltage across capacitance2.4Vpp
VDCAverage DC voltage across capacitance1.2V
SHIELD
DRVDriver capabilityƒ = 25kHz, SHLDn to GND, n = 1,2400pF
(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ=TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ>TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device can be permanently degraded, either mechanically or electrically.
(2) Limits are ensured by testing, design, or statistical analysis at 25Degree C. Limits over the operating temperature range are ensured through correlations using statistical quality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values can vary over time and also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
(4) No external capacitance connected.
(5) Effective resolution is the ratio of converter full scale range to RMS measurement noise.