SNOSDB6D December   2020  – October 2024 LMP7704-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics VS = 5 V
    6. 5.6 Electrical Characteristics VS = 10 V
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Radiation Hardened Performance
      2. 6.3.2 Engineering Model (Devices With /EM Suffix)
      3. 6.3.3 Diodes Between the Inputs
      4. 6.3.4 Capacitive Load
      5. 6.3.5 Input Capacitance
    4. 6.4 Device Functional Modes
      1. 6.4.1 Precision Current Source
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Low Input Voltage Noise
      2. 7.1.2 Total Noise Contribution
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

3 Description

The LMP7704-SP is a precision amplifier with low input bias, low offset voltage, 2.5MHz gain bandwidth product, and a wide supply voltage. The device is radiation hardened and operates in the military temperature range of −55°C to +125°C.

The high dc precision of this amplifier, specifically the low offset voltage of ±60µV and ultra-low input bias of ±500fA, makes this device an excellent choice for interfacing with precision sensors with high output impedances. This amplifier can be configured for transducer, bridge, strain gauge, and transimpedance amplification.

Device Information
PART NUMBER PACKAGE(1) BODY SIZE(2)
5962R1920601VXC,
Flight Model (QMLV),
RHA to 100-krad		 CFP (14) 9.73mm × 6.47mm
LMP7704HBH/EM,
Engineering Model(3)
(1) For more information, see Section 10.
(2) The body size (length × width) is a nominal value and does not include pins.
(3) These units are intended for engineering evaluation only. These units are processed to a noncompliant flow (that is, no burn-in, and so forth) and are tested to a temperature rating of 25°C only. These units are not suitable for qualification, production, radiation testing, or flight use. Parts are not warranted for performance over the full MIL specified temperature range of –55°C to +125°C or operating life. For more information about engineering models, see the Texas Instruments Engineering Evaluation Units versus MIL‑PRF‑38535 QML Class V Processing overview.
LMP7704-SP Typical Application Schematic Typical Application Schematic