SNOU201 February   2024

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Recommended Equipment Setup
    2. 2.2 Board Setup
      1. 2.2.1 Power Supplies
      2. 2.2.2 Inputs and Outputs
  7. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials
  8. 4Additional Information
    1. 4.1 Trademarks

3.3 Bill of Materials

Table 3-1 Bill of Materials (BOM)
DESIGNATOR QTY VALUE DESCRIPTION PART NUMBER MANUFACTURER PACKAGE REFERENCE

LBL1

1

Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll

THT-14-423-10

Brady

PCB Label 0.650 x 0.200 inch

C1

0

0.1uF

CAP, CERM, 0.1uF, 50V, +/- 10%, X7R, 1206

GRM319R71H104KA01D

MuRata

1206

FID1, FID2, FID3, FID4, FID5, FID6

0

Fiducial mark. There is nothing to buy or mount.

N/A

N/A

N/A

R1, R2, R3

0

0

RES, 0, 5%, 0.25 W, 1206

RC1206JR-070RL

Yageo America

1206

TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8, TP9

0

Test Point, Multipurpose, Green, TH

5126

Keystone Electronics

Green Multipurpose Testpoint

U1

0

36V High-Speed Comparators with Separate Input and Output Supplies

TLV1872DGSR

Texas Instruments

VSSOP10

XU1

0

Socket, DIP-10, 2.54mm Pitch, TH

110-87-310-41-001101

Preci-Dip

Socket, DIP-10, 2.54mm Pitch