SNOU205 December   2024 LMG2650

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
    5. 1.5 General TI High Voltage Evaluation User Safety Guidelines
      1. 1.5.1 Safety and Precautions
  7. 2Hardware
    1. 2.1 LMG2650EVM-100 Daughtercard
      1. 2.1.1 Test Points
      2. 2.1.2 Integrated Current Sensing
      3. 2.1.3 Enable Pin
      4. 2.1.4 GDH
      5. 2.1.5 Power Pins
      6. 2.1.6 Heat Sink
    2. 2.2 Motherboard
      1. 2.2.1 Bias Supply
      2. 2.2.2 PWM Input
      3. 2.2.3 Fault Protection
    3. 2.3 Recommended Footprint
    4. 2.4 Test Equipment
    5. 2.5 Test Procedure When Paired With LMG342X-BB-EVM
      1. 2.5.1 Setup
      2. 2.5.2 Start-Up and Operating Procedure
      3. 2.5.3 Test Results
      4. 2.5.4 Shutdown Procedure
      5. 2.5.5 Additional Operating Notes
  8. 3Hardware Design Files
    1. 3.1 LMG2650EVM-100 Schematic
    2. 3.2 Motherboard Schematic
    3. 3.3 PCB Layout
    4. 3.4 Bill of Materials
  9. 4Additional Information
    1. 4.1 Trademarks
  10. 5Related Documentation

2.1.5 Power Pins

There are some high frequency decoupling capacitors on the LMG2650EVM-100 from VDC to PGND to minimize voltage overshoot during switching, but more bulk capacitance is required to hold up the DC voltage during operation. TI recommends preventing any overlap and parasitic capacitance from VSW to VDC, PGND, and any logic pins. The two ground PGND and AGND pins are functionally isolated from each other on the LMG2650EVM-100.