SNVA427C January   2010  – December 2021 LMZ12003

 

  1.   Trademarks
  2. 1 Description
  3. 2 Packaging Highlights
  4. 3 Demo Board Features
  5. 4 Typical Applications
  6. 5 Demo Board Schematic
  7. 6 Demo Board Bill of Materials (BOM)
  8. 7 Demo Board Hookup
  9. 8 Demo Board Passive Components
  10. 9 Performance Characteristics
  11. 10Revision History

2 Packaging Highlights

  • 7-lead module package (similar to TO-263)
  • Single exposed die attach pad for enhanced thermal performance
  • 10.2-mm × 13.8-mm × 4.6-mm module package
  • High power density
  • 1.7-inch × 2.3-inch reduced size demo board form factor