SNVAA92 November 2023 LM63625-Q1 , TPS37-Q1 , TPS3703-Q1 , TPS3850-Q1
TI products provide FIT rates derived from the reliability guides of Siemens (SN) 29500 or International Electrotechnical Commission (IEC) TR 62380. SN 29500 differs from IEC TR 62380 in accounting for failures caused by silicon and package interactions. SN29500 provides only a total FIT rate, while IEC TR 62380 distinguishes between die FIT rate and package FIT rate for analysis.
Functional safety standards recommend that semiconductor component manufacturers estimate failures caused by silicon interaction with package materials and silicon-to-package connection points (pins). For functional safety-capable devices such as pre-regulators, low-dropout regulators, and voltage supervisors, TI provides functional safety FIT rate, failure mode distribution, and pin FMA reports.
Using the LM63625-Q1 as a reference, Table 3-1 lists the failure modes and their respective distribution.
Die Failure Modes | Failure Mode Distribution (%) |
---|---|
SW no output | 35 |
SW output not in specification – voltage or timing | 45 |
SW driver FET stuck on | 10 |
RESET false trip or fails to trip | 5 |
Short circuit any two pins | 5 |
The die failure modes listed in Table 3-1 are described in the following list: