SNVAA92 November 2023 LM63625-Q1 , TPS37-Q1 , TPS3703-Q1 , TPS3850-Q1
Table 3-2 shows the FMEDA analysis at the die level, while Table 3-3 and Table 3-4 detail the package (pin)-level analysis. Four failure modes are usually considered for each pin: pin open, pin short to GND, pin short to adjacent pin, and pin short to power supply. These four failure modes are evenly distributed, many TI products follow this empirical distribution. For the LM63625-Q1 and TPS37A-Q1 devices; however, the pin FMDs in Table 3-3 and Table 3-4 are adjusted based on the specific integrated circuit (IC) design and simulation results. The reason is that the Pin short to VIN fault rate is very low, most likely resulting in a pin open failure mode in the LM63625-Q1 and TPS37A-Q1.
Package FIT | 5 FIT | |
Pin numbers | 12 | |
FIT for each pin | 5 / 12 = 0.417 FIT | |
Failure mode for each pin | Distribution | FIT for each failure mode |
Pin open | 70% | 0.417 × 70% = 0.292 FIT |
Pin short to GND | 15% | 0.417 × 15% = 0.063 FIT |
Pin short to adjacent pin | 15% | 0.417 × 15% = 0.063 FIT |
Package FIT | 3 FIT | |
Pin numbers | 10 | |
FIT for each pin | 3 / 10 = 0.3 FIT | |
Failure mode for each pin | Distribution | FIT for each failure mode |
Pin open | 70% | 0.3 × 70% = 0.21 FIT |
Pin short to GND | 15% | 0.3 × 15% = 0.045 FIT |
Pin short to adjacent pin | 15% | 0.3 × 15% = 0.045 FIT |