SNVS967A August   2014  – November 2014 LM3643

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 Handling Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Switching Characteristics
    8. 8.8 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Flash Mode
      2. 9.3.2 Torch Mode
      3. 9.3.3 IR Mode
    4. 9.4 Device Functioning Modes
      1. 9.4.1 Start-Up (Enabling The Device)
      2. 9.4.2 Pass Mode
      3. 9.4.3 Power Amplifier Synchronization (TX)
      4. 9.4.4 Input Voltage Flash Monitor (IVFM)
      5. 9.4.5 Fault/Protections
        1. 9.4.5.1 Fault Operation
        2. 9.4.5.2 Flash Time-Out
        3. 9.4.5.3 Overvoltage Protection (OVP)
        4. 9.4.5.4 Current Limit
        5. 9.4.5.5 NTC Thermistor Input (Torch/Temp)
        6. 9.4.5.6 Undervoltage Lockout (UVLO)
        7. 9.4.5.7 Thermal Shutdown (TSD)
        8. 9.4.5.8 LED and/or VOUT Short Fault
    5. 9.5 Programming
      1. 9.5.1 Control Truth Table
      2. 9.5.2 I2C-Compatible Interface
        1. 9.5.2.1 Data Validity
        2. 9.5.2.2 Start and Stop Conditions
        3. 9.5.2.3 Transferring Data
        4. 9.5.2.4 I2C-Compatible Chip Address
    6. 9.6 Register Descriptions
      1. 9.6.1  Enable Register (0x01)
      2. 9.6.2  IVFM Register (0x02)
      3. 9.6.3  LED1 Flash Brightness Register (0x03)
      4. 9.6.4  LED2 Flash Brightness Register (0x04)
      5. 9.6.5  LED1 Torch Brightness Register (0x05)
      6. 9.6.6  LED2 Torch Brightness Register (0x06)
      7. 9.6.7  Boost Configuration Register (0x07)
      8. 9.6.8  Timing Configuration Register (0x08)
      9. 9.6.9  TEMP Register (0x09)
      10. 9.6.10 Flags1 Register (0x0A)
      11. 9.6.11 Flags2 Register (0x0B)
      12. 9.6.12 Device ID Register (0x0C)
      13. 9.6.13 Last Flash Register (0x0D)
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Output Capacitor Selection
        2. 10.2.2.2 Input Capacitor Selection
        3. 10.2.2.3 Inductor Selection
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Related Documentation
      1. 13.2.1 Related Links
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

13 Device and Documentation Support

13.1 Device Support

13.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

13.2 Related Documentation

13.2.1 Related Links

Table 3 below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 3. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
LM3643 Click here Click here Click here Click here Click here
LM3643A Click here Click here Click here Click here Click here

13.3 Trademarks

All trademarks are the property of their respective owners.

13.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.