SNVSAB6B March 2017 – July 2018 LP8863-Q1
PRODUCTION DATA.
THERMAL METRIC(1) | LP8863 | UNIT | |
---|---|---|---|
DCP (HTSSOP) | |||
38 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 32.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 19.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 8.8 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.3 | °C/W |
ψJB | Junction-to-board characterization parameter | 8.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.7 | °C/W |