SNVSBT8 March   2021 TPSM13604H

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 COT Control Circuit Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Overvoltage Comparator
      2. 7.3.2 Current Limit
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Zero Coil Current Detection
      5. 7.3.5 Prebiased Start-up
    4. 7.4 Device Functional Modes
      1. 7.4.1 Discontinuous Conduction and Continuous Conduction Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Design Steps for the TPSM13604 Application
          1. 8.2.2.1.1 Enable Divider, RENT, and RENB Selection
          2. 8.2.2.1.2 Output Voltage Selection
          3. 8.2.2.1.3 Soft-Start Capacitor, CSS, Selection
          4. 8.2.2.1.4 Output Capacitor, CO, Selection
            1. 8.2.2.1.4.1 Capacitance
            2. 8.2.2.1.4.2 ESR
          5. 8.2.2.1.5 Input Capacitor, CIN, Selection
          6. 8.2.2.1.6 ON-Time, RON, Resistor Selection
            1. 8.2.2.1.6.1 Discontinuous Conduction and Continuous Conduction Mode Selection
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Module SMT Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Power Dissipation and Board Thermal Requirements
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Glossary
    7. 11.7 Electrostatic Discharge Caution
  12. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TPSM13604UNIT
NDW (TO-PMOD)
7 PINS
RθJAJunction-to-ambient thermal resistance4 layer printed-circuit-board, 7.62 cm x 7.62 cm (3 in x 3 in) area, 1-oz copper, no air flow16°C/W
4 layer printed-circuit-board, 6.35 cm x 6.35 cm (2.5 in x 2.5 in) area, 1-oz copper, no air flow18.4
RθJC(top)Junction-to-case (top) thermal resistance1.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.