SNVSBU8A May   2021  – November 2021 LP5860

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Time-Multiplexing Matrix
      2. 8.3.2 Analog Dimming (Current Gain Control)
      3. 8.3.3 PWM Dimming
      4. 8.3.4 ON and OFF Control
      5. 8.3.5 Data Refresh Mode
      6. 8.3.6 Full Addressable SRAM
      7. 8.3.7 Protections and Diagnostics
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Program Procedure
      5. 9.2.5 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

9.2.3 Detailed Design Procedure

LP5860 requires an external capacitor CVCAP, whose value is 1 μF connected from VCAP to GND for proper operation of internal LDO. The device must be placed as close to the device as possible.

TI recommends that 1-μF capacitors be placed between VCC / VLED with GND, and a 1-nF capacitor placed between VIO with GND. Place the capacitors as close to the device as possible.

Pull-up resistors Rpull-up are requirement for SCL and SDA when using I2C as communication method. In typical applications, TI recommends 1.8-kΩ to 4.7-kΩ resistors.

To decrease thermal dissipation from device to ambient, resistors RCS can optionally be placed in serial with the LED. Voltage drop on these resistors must left enough margins for VSAT to ensure the device works normally.