SNVU755A January   2021  – June 2021 TLV841

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 Related Documentation
    2. 1.2 TLV841 Applications
  3. 2Schematic, Bill of Materials, and Layout
    1. 2.1 TLV841EVM Schematic
    2. 2.2 TLV841EVM Bill of Materials
    3. 2.3 Layout and Component Placement
    4. 2.4 Layout
  4. 3EVM Connectors
    1. 3.1 EVM Test Points
    2. 3.2 EVM Jumpers
  5. 4EVM Setup and Operation
    1. 4.1 Input Power (VDD)
    2. 4.2 Monitoring Voltage on SENSE Pin (TLV841S)
    3. 4.3 Monitoring Voltage on VDD (TLV841M and TLV841C)
    4. 4.4 Manual Reset (MR) (TLV841M)
    5. 4.5 Reset Output (RESET)
    6. 4.6 Reset Time Delay Programming (Program tD via CT) (TLV841C)
  6. 5Revision History

2.2 TLV841EVM Bill of Materials

Table 2-1 BOM
DESIGNATOR QTY VALUE DESCRIPTION PACKAGE REFERENCE PART NUMBER MANUFACTURER
PCB 1 Printed Circuit Board TLV841EVM Any
C1, C3 2 0.1 µF CAP, CERM, 0.1 µF, 16 V, ± 10%, X7R, 0603 0603 C0603C104K4RACTU Kemet
C2 1 0.01 µF CAP, CERM, 0.01 µF, 16 V, +/- 10%, X7R, 0603 0603 C0603C103K4RACTU Kemet
H1, H2, H3, H4 4 Bumpon, Hemisphere, 0.44 X 0.20, Clear Transparent Bumpon SJ-5303 (CLEAR) 3M
J1, J2, J3, J4, J5, J7 6 Header, 100mil, 2x1, TH Header, 2x1, 100mil, TH 800-10-002-10-001000 Mill-Max
J6, J8 2 Header, 100mil, 3x1, TH Header, 3x1, 100mil, TH 800-10-003-10-001000 Mill-Max
R1 1 30.1kΩ RES, 30.1 kΩ, 1%, 0.1 W, 0603 0603 RC0603FR-0730K1L Yageo America
R2 1 47.5kΩ RES, 47.5 kΩ, 1%, 0.1 W, 0603 0603 RC0603FR-0747K5L Yageo America
R3 1 10kΩ RES, 10.0 kΩ, 1%, 0.1 W, 0603 0603 RC0603FR-0710KL Yageo America
SH-J1, SH-J2, SH-J3,SH-J4, SH-J5 5 Shunt, 100mil, Tin plated, Black Shunt Connector Black Open Top, 2x1 SNT-100-BK-T-H Samtec
TP1, TP2, TP3, TP4 4 Test Point, Miniature, SMT Test Point, Miniature, SMT 5019 Keystone
U1 1 Tiny Nano-power Ultra-low Voltage Supervisor in WCSP Package (SENSE option) DSBGA4 TLV841SADL01YBHR Texas Instruments
FID1, FID2, FID3 0 Fiducial mark. There is nothing to buy or mount. Fiducial N/A N/A