SNVU820
February 2022
LM5149-Q1
Trademarks
1
High Density EVM Description
1.1
Typical Applications
1.2
Features and Electrical Performance
2
EVM Characteristics
3
Application Circuit Diagram
4
EVM Photo
5
Test Setup and Procedure
5.1
EVM Connections
5.2
Test Equipment
5.3
Recommended Test Setup
5.3.1
Input Connections
5.3.2
Output Connections
5.4
Test Procedure
5.4.1
Line and Load Regulation, Efficiency
6
Test Data and Performance Curves
6.1
Conversion Efficiency
6.2
Operating Waveforms
6.2.1
Switching
6.2.2
Load Transient Response
6.2.3
Line Transient Response
6.2.4
Start-Up and Shutdown With EN
6.2.5
Start-Up and Shutdown with VIN
6.3
Bode Plot
6.4
CISPR 25 EMI Performance
6.5
Thermal Performance
7
EVM Documentation
7.1
Schematic
7.2
List of Materials
7.3
PCB Layout
7.4
Component Drawings
8
Device and Documentation Support
8.1
Device Support
8.1.1
Development Support
8.2
Documentation Support
8.2.1
Related Documentation
8.2.1.1
PCB Layout Resources
8.2.1.2
Thermal Design Resources
8.2.1.2
Thermal Design Resources
AN-2020 Thermal Design by Insight, Not Hindsight Application Report
AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages Application Report
Semiconductor and IC Package Thermal Metrics Application Report
Thermal Design Made Simple with LM43603 and LM43602 Application Report
PowerPAD Thermally Enhanced Package Application Report
PowerPAD Made Easy Application Brief
Using New Thermal Metrics Application Report