SNVU872A September   2023  – March 2024 LM70880-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Test Setup and Procedure
      1. 2.1.1 EVM Connections
      2. 2.1.2 Test Equipment
      3. 2.1.3 Recommended Test Setup
        1. 2.1.3.1 Input Connections
        2. 2.1.3.2 Output Connections
      4. 2.1.4 Test Procedure
        1. 2.1.4.1 Line and Load Regulation, Efficiency
  8. 3Implementation Results
    1. 3.1 Performance Data and Results
      1. 3.1.1 EVM Characteristics
      2. 3.1.2 Conversion Efficiency
      3. 3.1.3 Operating Waveforms
        1. 3.1.3.1 Switching
        2. 3.1.3.2 Load Transient Response
        3. 3.1.3.3 Line Transient Response
        4. 3.1.3.4 Start-Up and Shutdown With EN
        5. 3.1.3.5 Start-Up with VIN
      4. 3.1.4 Bode Plot
      5. 3.1.5 CISPR 25 EMI Performance
      6. 3.1.6 Thermal Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
      1. 4.2.1 Component Drawings
      2. 4.2.2 Multi-Layer Stackup
    3. 4.3 Bill of Materials
  10. 5Compliance Information
    1. 5.1 Compliance and Certifications
  11. 6Related Documentation
    1. 6.1 Supplemental Content
      1. 6.1.1 Development Support
      2. 6.1.2 PCB Layout Resources
      3. 6.1.3 Thermal Design Resources
  12. 7Additional Information
    1. 7.1 Trademarks
  13. 8Revision History

3.1.6 Thermal Performance

Figure 4-11 shows the thermal performance image.

GUID-20230831-SS0I-WWRV-CSGZ-BSN8J8G5BHSQ-low.svg Figure 3-11 Thermal Performance, VIN = 48V, IOUT = 8A, Tamb = 25°C, No Airflow