SNVU872A
September 2023 – March 2024
LM70880-Q1
1
Description
Features
Applications
5
1
Evaluation Module Overview
1.1
Introduction
1.2
Kit Contents
1.3
Specification
1.4
Device Information
2
Hardware
2.1
Test Setup and Procedure
2.1.1
EVM Connections
2.1.2
Test Equipment
2.1.3
Recommended Test Setup
2.1.3.1
Input Connections
2.1.3.2
Output Connections
2.1.4
Test Procedure
2.1.4.1
Line and Load Regulation, Efficiency
3
Implementation Results
3.1
Performance Data and Results
3.1.1
EVM Characteristics
3.1.2
Conversion Efficiency
3.1.3
Operating Waveforms
3.1.3.1
Switching
3.1.3.2
Load Transient Response
3.1.3.3
Line Transient Response
3.1.3.4
Start-Up and Shutdown With EN
3.1.3.5
Start-Up with VIN
3.1.4
Bode Plot
3.1.5
CISPR 25 EMI Performance
3.1.6
Thermal Performance
4
Hardware Design Files
4.1
Schematic
4.2
PCB Layout
4.2.1
Component Drawings
4.2.2
Multi-Layer Stackup
4.3
Bill of Materials
5
Compliance Information
5.1
Compliance and Certifications
6
Related Documentation
6.1
Supplemental Content
6.1.1
Development Support
6.1.2
PCB Layout Resources
6.1.3
Thermal Design Resources
7
Additional Information
7.1
Trademarks
8
Revision History
6.1.3
Thermal Design Resources
AN-2020 Thermal Design by Insight, Not Hindsight Application Report
AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages Application Report
Semiconductor and IC Package Thermal Metrics Application Report
Thermal Design Made Simple with LM43603 and LM43602 Application Report
PowerPAD Thermally Enhanced Package Application Report
PowerPAD Made Easy Application Brief
Using New Thermal Metrics Application Report