SNVU874 December   2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Connector, Jumper, DIP switch and Test point Description
      1. 2.1.1 Connector Descriptions
      2. 2.1.2 Jumper Descriptions
      3. 2.1.3 DIP Switch Descriptions
      4. 2.1.4 Test Points Description
      5. 2.1.5 Easy to Use Features
  9. 3Implementation Results
    1. 3.1 Test Setup and Procedure
      1. 3.1.1 Test Setup
      2. 3.1.2 Configurations for Stacking Two EVMs
      3. 3.1.3 Test Procedure
      4. 3.1.4 Precautions
  10. 4Application Curves
    1. 4.1 Efficiency
    2. 4.2 Steady State Waveforms
    3. 4.3 Step Load Response
    4. 4.4 Sync Operation
    5. 4.5 Thermal Performance
  11. 5Hardware Design Files
    1. 5.1 Schematic
    2. 5.2 PCB Layers
    3. 5.3 Bill of Materials
  12. 6Additional Information
    1.     Trademarks

3.1.2 Configurations for Stacking Two EVMs

  1. Connect VIN, VOUT, GND from two EVMs together with short, thick cables, respectively.
  2. Select CFG2=Level 9 for the primary EVM for 4-phase interleaving operation. Select CFG2=Level 7 for 3-phase interleaving operation.
  3. Select CFG2=Level 15 for the secondary EVM.
  4. Connect J10 of the primary EVM and J9 of the secondary EVM with ribbon cable. Refer to Figure 3-2.
LM5125EVM-BST Connecting the Primary EVM and Secondary EVM with Ribbon Cable Figure 3-2 Connecting the Primary EVM and Secondary EVM with Ribbon Cable