SNVU874 December   2024

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Connector, Jumper, DIP switch and Test point Description
      1. 2.1.1 Connector Descriptions
      2. 2.1.2 Jumper Descriptions
      3. 2.1.3 DIP Switch Descriptions
      4. 2.1.4 Test Points Description
      5. 2.1.5 Easy to Use Features
  9. 3Implementation Results
    1. 3.1 Test Setup and Procedure
      1. 3.1.1 Test Setup
      2. 3.1.2 Configurations for Stacking Two EVMs
      3. 3.1.3 Test Procedure
      4. 3.1.4 Precautions
  10. 4Application Curves
    1. 4.1 Efficiency
    2. 4.2 Steady State Waveforms
    3. 4.3 Step Load Response
    4. 4.4 Sync Operation
    5. 4.5 Thermal Performance
  11. 5Hardware Design Files
    1. 5.1 Schematic
    2. 5.2 PCB Layers
    3. 5.3 Bill of Materials
  12. 6Additional Information
    1.     Trademarks

5.2 PCB Layers

LM5125EVM-BST Top Silk Screen Figure 5-2 Top Silk Screen
LM5125EVM-BST Bottom Silk Screen Figure 5-3 Bottom Silk Screen
LM5125EVM-BST Top Layer Figure 5-4 Top Layer
LM5125EVM-BST Signal Layer 1 Figure 5-5 Signal Layer 1
LM5125EVM-BST Signal Layer 2 Figure 5-6 Signal Layer 2
LM5125EVM-BST Signal Layer 3 Figure 5-7 Signal Layer 3
LM5125EVM-BST Signal Layer 4 Figure 5-8 Signal Layer 4
LM5125EVM-BST Bottom Layer Figure 5-9 Bottom Layer