SNVU899 October   2024 TPS3424

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 EVM Connectors
      1. 2.1.1 EVM Jumpers
      2. 2.1.2 EVM Test Points
    2. 2.2 EVM Setup and Operation
      1. 2.2.1 Input Power VDD
      2. 2.2.2 Pushbutton input
  7. 3Implementation Results
    1. 3.1 EVM Performance Results
  8. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  9. 5Additional Information
    1. 5.1 Trademarks

4.2 PCB Layout

Figure 2-1 show the top assemblies of the printed circuit board (PCB) to display the component placement of the EVM.

Figure 4-3 show the top layouts, Figure 4-4 andFigure 4-5 show the top and bottom layers, and Figure 4-6 shows the top solder mask of the EVM.

TPS3424EVM Component Placement - Top AssemblyFigure 4-2 Component Placement - Top Assembly
TPS3424EVM Top LayerFigure 4-4 Top Layer
TPS3424EVM Top Solder MaskFigure 4-6 Top Solder Mask
TPS3424EVM Layout - TopFigure 4-3 Layout - Top
TPS3424EVM Bottom LayerFigure 4-5 Bottom Layer