SNVU917
September 2024
LM706A0-Q1
1
Description
Features
Applications
5
1
Evaluation Module Overview
1.1
Introduction
1.2
Kit Contents
1.3
Specification
1.4
Device Information
2
Hardware
2.1
Test Setup and Procedure
2.1.1
EVM Connections
2.1.2
Test Equipment
2.1.3
Recommended Test Setup
2.1.3.1
Input Connections
2.1.3.2
Output Connections
2.1.4
Test Procedure
2.1.4.1
Line and Load Regulation, Efficiency
3
Implementation Results
3.1
Performance Data and Results
3.1.1
EVM Characteristics
3.1.2
Conversion Efficiency
3.1.3
Operating Waveforms
3.1.3.1
Switching
3.1.3.2
Load Transient Response
3.1.3.3
Short-Circuit Recovery
3.1.3.4
Start-Up and Shutdown With EN
3.1.3.5
Start-Up With VIN
3.1.4
Bode Plot
3.1.5
CISPR 25 EMI Performance
3.1.6
Thermal Performance
4
Hardware Design Files
4.1
Schematic
4.2
PCB Layout
4.2.1
Component Drawings
4.2.2
Multi-Layer Stackup
4.3
Bill of Materials
5
Compliance Information
5.1
Compliance and Certifications
6
Related Documentation
6.1
Supplemental Content
6.1.1
Development Support
6.1.2
PCB Layout Resources
6.1.3
Thermal Design Resources
7
Additional Information
7.1
Trademarks
6.1.3
Thermal Design Resources
Texas Instruments,
AN-2020 Thermal Design by Insight, Not Hindsight
application report
Texas Instruments,
AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
application report
Texas Instruments,
Semiconductor and IC Package Thermal Metrics
application report
Texas Instruments,
Thermal Design Made Simple with LM43603 and LM43602
application report
Texas Instruments,
PowerPAD™
Thermally Enhanced Package
application report
Texas Instruments,
PowerPAD™ Made Easy
application brief
Texas Instruments,
Using New Thermal Metrics
application report