SNVU917 September   2024 LM706A0-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Test Setup and Procedure
      1. 2.1.1 EVM Connections
      2. 2.1.2 Test Equipment
      3. 2.1.3 Recommended Test Setup
        1. 2.1.3.1 Input Connections
        2. 2.1.3.2 Output Connections
      4. 2.1.4 Test Procedure
        1. 2.1.4.1 Line and Load Regulation, Efficiency
  8. 3Implementation Results
    1. 3.1 Performance Data and Results
      1. 3.1.1 EVM Characteristics
      2. 3.1.2 Conversion Efficiency
      3. 3.1.3 Operating Waveforms
        1. 3.1.3.1 Switching
        2. 3.1.3.2 Load Transient Response
        3. 3.1.3.3 Short-Circuit Recovery
        4. 3.1.3.4 Start-Up and Shutdown With EN
        5. 3.1.3.5 Start-Up With VIN
      4. 3.1.4 Bode Plot
      5. 3.1.5 CISPR 25 EMI Performance
      6. 3.1.6 Thermal Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
      1. 4.2.1 Component Drawings
      2. 4.2.2 Multi-Layer Stackup
    3. 4.3 Bill of Materials
  10. 5Compliance Information
    1. 5.1 Compliance and Certifications
  11. 6Related Documentation
    1. 6.1 Supplemental Content
      1. 6.1.1 Development Support
      2. 6.1.2 PCB Layout Resources
      3. 6.1.3 Thermal Design Resources
  12. 7Additional Information
    1. 7.1 Trademarks

4.2 PCB Layout

Figure 4-2 through Figure 4-9 show the design of the LM706A0-Q1 EVM using a six-layer PCB with 2oz copper thickness.

Figure 4-2 Top Copper (Top View)
Figure 4-3 Layer 2 Copper (Top View)
Figure 4-4 Layer 3 Copper (Top View)
Figure 4-5 Layer 4 Copper (Top View)
Figure 4-6 Layer 5 Copper (Top View)
Figure 4-7 Bottom Copper (Top View)