The BP-CC33-BBB-ADAPT provides an interface
between BP-CC33xx EVMs and the BeagleBone® Black development platform. This adapter board handles
high-speed SDIO communication and provides improved EMC performance for the wireless
radio. When fully interconnected, this board enables seamless evaluation with a host
MPU and Linux® operating system.
This user's guide provides details on the
BP-CC33-BBB-ADAPT hardware and kitting. For more information on the evaluation
set-up, please see also the SimpleLink™ CC3301 Wi-Fi 6
and Bluetooth® Low Energy BoosterPack™ plug-in module User's Guide (
Top map
BP-CC33-BBB-ADAPT Hardware
BP-CC33-BBB-ADAPT Hardware
Description
Description
Features
Features
Hardware Image
Hardware Image
Evaluation Module Overview
Evaluation Module Overview
Introduction
Introduction
Kit Contents
Kit Contents
Hardware
Hardware
Additional Images
Additional Images
Header Information
Header Information
Hardware Design Files
Hardware Design Files
Schematics
Schematics
PCB Layouts
PCB Layouts
Bill of Materials (BOM)
Bill of Materials (BOM)
Compliance Information
Compliance Information
Compliance and Certifications
Compliance and Certifications
Related Documentation
Related Documentation
Supplemental Content
Supplemental Content
IMPORTANT NOTICE AND DISCLAIMER
IMPORTANT NOTICE AND DISCLAIMER
BP-CC33-BBB-ADAPT Hardware
BP-CC33-BBB-ADAPT Hardware
Description
The BP-CC33-BBB-ADAPT board is an adapter board to interface between a SimpleLink™ CC3301 Wi-Fi 6 and Bluetooth® Low Energy BoosterPack plug-in module and the BeagleBone Black development platform. The
connection to the BeagleBone Black platform allows for processor and Linux
evaluation for the CC33xx devices.
Description
The BP-CC33-BBB-ADAPT board is an adapter board to interface between a SimpleLink™ CC3301 Wi-Fi 6 and Bluetooth® Low Energy BoosterPack plug-in module and the BeagleBone Black development platform. The
connection to the BeagleBone Black platform allows for processor and Linux
evaluation for the CC33xx devices.
The BP-CC33-BBB-ADAPT board is an adapter board to interface between a SimpleLink™ CC3301 Wi-Fi 6 and Bluetooth® Low Energy BoosterPack plug-in module and the BeagleBone Black development platform. The
connection to the BeagleBone Black platform allows for processor and Linux
evaluation for the CC33xx devices.
The BP-CC33-BBB-ADAPT board is an adapter board to interface between a SimpleLink™ CC3301 Wi-Fi 6 and Bluetooth® Low Energy BoosterPack plug-in module and the BeagleBone Black development platform. The
connection to the BeagleBone Black platform allows for processor and Linux
evaluation for the CC33xx devices.SimpleLinkBluetoothBoosterPackBeagleBone
Features
Easily connect BP-CC33xx EVMs to the BeagleBone Black development platform
Layout designed for optimal signal integrity for digital signals
Header topology provides component clearance when fully assembled
Features
Easily connect BP-CC33xx EVMs to the BeagleBone Black development platform
Layout designed for optimal signal integrity for digital signals
Header topology provides component clearance when fully assembled
Easily connect BP-CC33xx EVMs to the BeagleBone Black development platform
Layout designed for optimal signal integrity for digital signals
Header topology provides component clearance when fully assembled
Easily connect BP-CC33xx EVMs to the BeagleBone Black development platform
Layout designed for optimal signal integrity for digital signals
Header topology provides component clearance when fully assembled
Easily connect BP-CC33xx EVMs to the BeagleBone Black development platformLayout designed for optimal signal integrity for digital signalsHeader topology provides component clearance when fully assembled
Hardware Image
Hardware Image
Evaluation Module
Overview
Introduction
The BP-CC33-BBB-ADAPT provides an interface
between BP-CC33xx EVMs and the BeagleBone Black development platform. This adapter board handles
high-speed SDIO communication and provides improved EMC performance for the wireless
radio. When fully interconnected, this board enables seamless evaluation with a host
MPU and Linux operating system.
This user's guide provides details on the
BP-CC33-BBB-ADAPT hardware and kitting. For more information on the evaluation
set-up, please see also the SimpleLink CC3301 Wi-Fi 6
and Bluetooth Low Energy BoosterPack plug-in module User's Guide ().
Kit Contents
BP-CC33-BBB-ADAPT PCB
Evaluation Module
Overview
Introduction
The BP-CC33-BBB-ADAPT provides an interface
between BP-CC33xx EVMs and the BeagleBone Black development platform. This adapter board handles
high-speed SDIO communication and provides improved EMC performance for the wireless
radio. When fully interconnected, this board enables seamless evaluation with a host
MPU and Linux operating system.
This user's guide provides details on the
BP-CC33-BBB-ADAPT hardware and kitting. For more information on the evaluation
set-up, please see also the SimpleLink CC3301 Wi-Fi 6
and Bluetooth Low Energy BoosterPack plug-in module User's Guide ().
Introduction
The BP-CC33-BBB-ADAPT provides an interface
between BP-CC33xx EVMs and the BeagleBone Black development platform. This adapter board handles
high-speed SDIO communication and provides improved EMC performance for the wireless
radio. When fully interconnected, this board enables seamless evaluation with a host
MPU and Linux operating system.
This user's guide provides details on the
BP-CC33-BBB-ADAPT hardware and kitting. For more information on the evaluation
set-up, please see also the SimpleLink CC3301 Wi-Fi 6
and Bluetooth Low Energy BoosterPack plug-in module User's Guide ().
The BP-CC33-BBB-ADAPT provides an interface
between BP-CC33xx EVMs and the BeagleBone Black development platform. This adapter board handles
high-speed SDIO communication and provides improved EMC performance for the wireless
radio. When fully interconnected, this board enables seamless evaluation with a host
MPU and Linux operating system.
This user's guide provides details on the
BP-CC33-BBB-ADAPT hardware and kitting. For more information on the evaluation
set-up, please see also the SimpleLink CC3301 Wi-Fi 6
and Bluetooth Low Energy BoosterPack plug-in module User's Guide ().
The BP-CC33-BBB-ADAPT provides an interface
between BP-CC33xx EVMs and the BeagleBone Black development platform. This adapter board handles
high-speed SDIO communication and provides improved EMC performance for the wireless
radio. When fully interconnected, this board enables seamless evaluation with a host
MPU and Linux operating system.BeagleBoneLinuxThis user's guide provides details on the
BP-CC33-BBB-ADAPT hardware and kitting. For more information on the evaluation
set-up, please see also the SimpleLink CC3301 Wi-Fi 6
and Bluetooth Low Energy BoosterPack plug-in module User's Guide ().SimpleLinkBluetoothBoosterPack
Kit Contents
BP-CC33-BBB-ADAPT PCB
Kit Contents
BP-CC33-BBB-ADAPT PCB
BP-CC33-BBB-ADAPT PCB
BP-CC33-BBB-ADAPT PCB
BP-CC33-BBB-ADAPT PCB
Hardware
Additional Images
BeagleBone Black Connection
Header Information
The BP-CC33-BBB-ADAPT adapter board provides two
sets of headers. J8 and J9 are 46-pin headers to enable connection to the BeagleBone
Black development platform. P1 and P2 are 20-pin headers to enable connection to the
SimpleLink CC33xx Wi-Fi 6 and Bluetooth Low Energy BoosterPack plug-in module.
Hardware
Additional Images
BeagleBone Black Connection
Additional Images
BeagleBone Black Connection
BeagleBone Black Connection
BeagleBone Black Connection
BeagleBone Black Connection
Header Information
The BP-CC33-BBB-ADAPT adapter board provides two
sets of headers. J8 and J9 are 46-pin headers to enable connection to the BeagleBone
Black development platform. P1 and P2 are 20-pin headers to enable connection to the
SimpleLink CC33xx Wi-Fi 6 and Bluetooth Low Energy BoosterPack plug-in module.
Header Information
The BP-CC33-BBB-ADAPT adapter board provides two
sets of headers. J8 and J9 are 46-pin headers to enable connection to the BeagleBone
Black development platform. P1 and P2 are 20-pin headers to enable connection to the
SimpleLink CC33xx Wi-Fi 6 and Bluetooth Low Energy BoosterPack plug-in module.
The BP-CC33-BBB-ADAPT adapter board provides two
sets of headers. J8 and J9 are 46-pin headers to enable connection to the BeagleBone
Black development platform. P1 and P2 are 20-pin headers to enable connection to the
SimpleLink CC33xx Wi-Fi 6 and Bluetooth Low Energy BoosterPack plug-in module.
The BP-CC33-BBB-ADAPT adapter board provides two
sets of headers. J8 and J9 are 46-pin headers to enable connection to the BeagleBone
Black development platform. P1 and P2 are 20-pin headers to enable connection to the
SimpleLink CC33xx Wi-Fi 6 and Bluetooth Low Energy BoosterPack plug-in module.
Hardware Design Files
Schematics
BP-CC33-BBB-ADAPT
Schematic
PCB Layouts
Top Side Layer Plot
Bottom Side Layer Plot
Bill of Materials (BOM)
Bill of Materials
Designator
Quantity
Value
Description
Package Reference
Part Number
Manufacturer
J8, J9
2
CONN HEADER VERT 46POS 2.54MM
Header, 2.54mm, 23x2, TH
PRPC023DAAN-RC
Sullins Connector Solutions
P1, P2
2
CONN HEADER VERT 20POS 2.54MM
Header, 2.54mm, 10x2, TH
PH2-20-UA
Adam Tech
Hardware Design Files
Schematics
BP-CC33-BBB-ADAPT
Schematic
Schematics
BP-CC33-BBB-ADAPT
Schematic
BP-CC33-BBB-ADAPT
Schematic
BP-CC33-BBB-ADAPT
Schematic
BP-CC33-BBB-ADAPT
Schematic
PCB Layouts
Top Side Layer Plot
Bottom Side Layer Plot
PCB Layouts
Top Side Layer Plot
Bottom Side Layer Plot
Top Side Layer Plot
Bottom Side Layer Plot
Top Side Layer Plot
Top Side Layer Plot
Bottom Side Layer Plot
Bottom Side Layer Plot
Bill of Materials (BOM)
Bill of Materials
Designator
Quantity
Value
Description
Package Reference
Part Number
Manufacturer
J8, J9
2
CONN HEADER VERT 46POS 2.54MM
Header, 2.54mm, 23x2, TH
PRPC023DAAN-RC
Sullins Connector Solutions
P1, P2
2
CONN HEADER VERT 20POS 2.54MM
Header, 2.54mm, 10x2, TH
PH2-20-UA
Adam Tech
Bill of Materials (BOM)
Bill of Materials
Designator
Quantity
Value
Description
Package Reference
Part Number
Manufacturer
J8, J9
2
CONN HEADER VERT 46POS 2.54MM
Header, 2.54mm, 23x2, TH
PRPC023DAAN-RC
Sullins Connector Solutions
P1, P2
2
CONN HEADER VERT 20POS 2.54MM
Header, 2.54mm, 10x2, TH
PH2-20-UA
Adam Tech
Bill of Materials
Designator
Quantity
Value
Description
Package Reference
Part Number
Manufacturer
J8, J9
2
CONN HEADER VERT 46POS 2.54MM
Header, 2.54mm, 23x2, TH
PRPC023DAAN-RC
Sullins Connector Solutions
P1, P2
2
CONN HEADER VERT 20POS 2.54MM
Header, 2.54mm, 10x2, TH
PH2-20-UA
Adam Tech
Bill of Materials
Designator
Quantity
Value
Description
Package Reference
Part Number
Manufacturer
J8, J9
2
CONN HEADER VERT 46POS 2.54MM
Header, 2.54mm, 23x2, TH
PRPC023DAAN-RC
Sullins Connector Solutions
P1, P2
2
CONN HEADER VERT 20POS 2.54MM
Header, 2.54mm, 10x2, TH
PH2-20-UA
Adam Tech
Bill of Materials
Designator
Quantity
Value
Description
Package Reference
Part Number
Manufacturer
J8, J9
2
CONN HEADER VERT 46POS 2.54MM
Header, 2.54mm, 23x2, TH
PRPC023DAAN-RC
Sullins Connector Solutions
P1, P2
2
CONN HEADER VERT 20POS 2.54MM
Header, 2.54mm, 10x2, TH
PH2-20-UA
Adam Tech
Designator
Quantity
Value
Description
Package Reference
Part Number
Manufacturer
Designator
Quantity
Value
Description
Package Reference
Part Number
Manufacturer
DesignatorQuantityValueDescriptionPackage ReferencePart NumberManufacturer
J8, J9
2
CONN HEADER VERT 46POS 2.54MM
Header, 2.54mm, 23x2, TH
PRPC023DAAN-RC
Sullins Connector Solutions
P1, P2
2
CONN HEADER VERT 20POS 2.54MM
Header, 2.54mm, 10x2, TH
PH2-20-UA
Adam Tech
J8, J9
2
CONN HEADER VERT 46POS 2.54MM
Header, 2.54mm, 23x2, TH
PRPC023DAAN-RC
Sullins Connector Solutions
J8, J92 CONN HEADER VERT 46POS 2.54MMHeader, 2.54mm, 23x2, THPRPC023DAAN-RCSullins Connector Solutions
P1, P2
2
CONN HEADER VERT 20POS 2.54MM
Header, 2.54mm, 10x2, TH
PH2-20-UA
Adam Tech
P1, P22 CONN HEADER VERT 20POS 2.54MMHeader, 2.54mm, 10x2, THPH2-20-UAAdam Tech
Compliance Information
Compliance and Certifications
The BP-CC33-BBB-ADAPT is compliant with REACH,
RoHS, WEEE, and CE.
Compliance Information
Compliance and Certifications
The BP-CC33-BBB-ADAPT is compliant with REACH,
RoHS, WEEE, and CE.
Compliance and Certifications
The BP-CC33-BBB-ADAPT is compliant with REACH,
RoHS, WEEE, and CE.
The BP-CC33-BBB-ADAPT is compliant with REACH,
RoHS, WEEE, and CE.
The BP-CC33-BBB-ADAPT is compliant with REACH,
RoHS, WEEE, and CE.
Related Documentation
Supplemental Content
SimpleLink CC3301 Wi-Fi
6 and Bluetooth Low Energy BoosterPack Plug-in Module (BP-CC3301)
Related Documentation
Supplemental Content
SimpleLink CC3301 Wi-Fi
6 and Bluetooth Low Energy BoosterPack Plug-in Module (BP-CC3301)
Supplemental Content
SimpleLink CC3301 Wi-Fi
6 and Bluetooth Low Energy BoosterPack Plug-in Module (BP-CC3301)
SimpleLink CC3301 Wi-Fi
6 and Bluetooth Low Energy BoosterPack Plug-in Module (BP-CC3301)
SimpleLink CC3301 Wi-Fi
6 and Bluetooth Low Energy BoosterPack Plug-in Module (BP-CC3301)
SimpleLink CC3301 Wi-Fi
6 and Bluetooth Low Energy BoosterPack Plug-in Module (BP-CC3301)SimpleLinkBluetoothBoosterPack
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING
DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION
OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER
RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES,
EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES
OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT
OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers
designing with TI products. You are solely responsible for (1) selecting
the appropriate TI products for your application, (2) designing,
validating and testing your application, and (3) ensuring your
application meets applicable standards, and any other safety, security, regulatory
or other requirements.
These resources are subject to change without
notice. TI grants you permission to use these resources only for
development of an application that uses the TI products described in the
resource. Other reproduction and display of these resources is
prohibited. No license is granted to any other TI intellectual property
right or to any third party intellectual property right. TI disclaims
responsibility for, and you will fully indemnify TI and its
representatives against, any claims, damages, costs, losses, and
liabilities arising out of your use of these resources.
TI’s products are provided subject to
TI’s Terms of Sale or other applicable
terms available either on ti.com or provided in conjunction with such
TI products. TI’s provision of these resources does not expand or
otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address:
Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING
DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION
OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER
RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES,
EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES
OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT
OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers
designing with TI products. You are solely responsible for (1) selecting
the appropriate TI products for your application, (2) designing,
validating and testing your application, and (3) ensuring your
application meets applicable standards, and any other safety, security, regulatory
or other requirements.
These resources are subject to change without
notice. TI grants you permission to use these resources only for
development of an application that uses the TI products described in the
resource. Other reproduction and display of these resources is
prohibited. No license is granted to any other TI intellectual property
right or to any third party intellectual property right. TI disclaims
responsibility for, and you will fully indemnify TI and its
representatives against, any claims, damages, costs, losses, and
liabilities arising out of your use of these resources.
TI’s products are provided subject to
TI’s Terms of Sale or other applicable
terms available either on ti.com or provided in conjunction with such
TI products. TI’s provision of these resources does not expand or
otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address:
Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING
DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION
OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER
RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES,
EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES
OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT
OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers
designing with TI products. You are solely responsible for (1) selecting
the appropriate TI products for your application, (2) designing,
validating and testing your application, and (3) ensuring your
application meets applicable standards, and any other safety, security, regulatory
or other requirements.
These resources are subject to change without
notice. TI grants you permission to use these resources only for
development of an application that uses the TI products described in the
resource. Other reproduction and display of these resources is
prohibited. No license is granted to any other TI intellectual property
right or to any third party intellectual property right. TI disclaims
responsibility for, and you will fully indemnify TI and its
representatives against, any claims, damages, costs, losses, and
liabilities arising out of your use of these resources.
TI’s products are provided subject to
TI’s Terms of Sale or other applicable
terms available either on ti.com or provided in conjunction with such
TI products. TI’s provision of these resources does not expand or
otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING
DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION
OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER
RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES,
EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES
OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT
OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers
designing with TI products. You are solely responsible for (1) selecting
the appropriate TI products for your application, (2) designing,
validating and testing your application, and (3) ensuring your
application meets applicable standards, and any other safety, security, regulatory
or other requirements.
These resources are subject to change without
notice. TI grants you permission to use these resources only for
development of an application that uses the TI products described in the
resource. Other reproduction and display of these resources is
prohibited. No license is granted to any other TI intellectual property
right or to any third party intellectual property right. TI disclaims
responsibility for, and you will fully indemnify TI and its
representatives against, any claims, damages, costs, losses, and
liabilities arising out of your use of these resources.
TI’s products are provided subject to
TI’s Terms of Sale or other applicable
terms available either on ti.com or provided in conjunction with such
TI products. TI’s provision of these resources does not expand or
otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING
DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION
OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER
RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES,
EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES
OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT
OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers
designing with TI products. You are solely responsible for (1) selecting
the appropriate TI products for your application, (2) designing,
validating and testing your application, and (3) ensuring your
application meets applicable standards, and any other safety, security, regulatory
or other requirements.
These resources are subject to change without
notice. TI grants you permission to use these resources only for
development of an application that uses the TI products described in the
resource. Other reproduction and display of these resources is
prohibited. No license is granted to any other TI intellectual property
right or to any third party intellectual property right. TI disclaims
responsibility for, and you will fully indemnify TI and its
representatives against, any claims, damages, costs, losses, and
liabilities arising out of your use of these resources.
TI’s products are provided subject to
TI’s Terms of Sale or other applicable
terms available either on ti.com or provided in conjunction with such
TI products. TI’s provision of these resources does not expand or
otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING
DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION
OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER
RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES,
EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES
OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT
OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING
DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION
OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER
RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES,
EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES
OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT
OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers
designing with TI products. You are solely responsible for (1) selecting
the appropriate TI products for your application, (2) designing,
validating and testing your application, and (3) ensuring your
application meets applicable standards, and any other safety, security, regulatory
or other requirements.
These resources are intended for skilled developers
designing with TI products. You are solely responsible for (1) selecting
the appropriate TI products for your application, (2) designing,
validating and testing your application, and (3) ensuring your
application meets applicable standards, and any other safety, security, regulatory
or other requirements.
These resources are subject to change without
notice. TI grants you permission to use these resources only for
development of an application that uses the TI products described in the
resource. Other reproduction and display of these resources is
prohibited. No license is granted to any other TI intellectual property
right or to any third party intellectual property right. TI disclaims
responsibility for, and you will fully indemnify TI and its
representatives against, any claims, damages, costs, losses, and
liabilities arising out of your use of these resources.
These resources are subject to change without
notice. TI grants you permission to use these resources only for
development of an application that uses the TI products described in the
resource. Other reproduction and display of these resources is
prohibited. No license is granted to any other TI intellectual property
right or to any third party intellectual property right. TI disclaims
responsibility for, and you will fully indemnify TI and its
representatives against, any claims, damages, costs, losses, and
liabilities arising out of your use of these resources.
TI’s products are provided subject to
TI’s Terms of Sale or other applicable
terms available either on ti.com or provided in conjunction with such
TI products. TI’s provision of these resources does not expand or
otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI’s products are provided subject to
TI’s Terms of Sale or other applicable
terms available either on ti.com or provided in conjunction with such
TI products. TI’s provision of these resources does not expand or
otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.TI’s Terms of Saleti.com
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
IMPORTANT NOTICE
Mailing Address:
Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
Mailing Address:
Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
Mailing Address:
Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
Mailing Address:
Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
Mailing Address:
Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
Copyright © 2023, Texas Instruments Incorporated).