SPAU022 april   2023

 

  1.   Description
  2.   Features
  3.   3
  4. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
  5. 2Hardware
    1. 2.1 Additional Images
    2. 2.2 Header Information
  6. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  7. 4Compliance Information
    1. 4.1 Compliance and Certifications
  8. 5Related Documentation
    1. 5.1 Supplemental Content

Features

  • Easily connect BP-CC33xx EVMs to the BeagleBone Black development platform
  • Layout designed for optimal signal integrity for digital signals
  • Header topology provides component clearance when fully assembled