SPAU023 June   2024

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
  6. 2Hardware
    1. 2.1 System Description
      1. 2.1.1 Key Features
        1. 2.1.1.1 Power Supply
        2. 2.1.1.2 Memory
        3. 2.1.1.3 JTAG Emulator
        4. 2.1.1.4 Supported Interfaces and Peripherals
        5. 2.1.1.5 Expansion Connectors/Headers to Support Application-specific Add‐On Boards
        6. 2.1.1.6 ADC
      2. 2.1.2 Important Usage Notes:
        1. 2.1.2.1 Electrostatic Discharge (ESD) Compliance
        2. 2.1.2.2 IO Cable Length
      3. 2.1.3 Functional Block Diagram
      4. 2.1.4 Power ON/OFF Procedures
        1. 2.1.4.1 Power-On Procedure
        2. 2.1.4.2 Power-Off Procedure
        3. 2.1.4.3 Power Test Points
      5. 2.1.5 Peripheral and Major Component Description
        1. 2.1.5.1 Clocking
        2. 2.1.5.2 EtherCAT Interface
          1. 2.1.5.2.1 DP83826 PHY Strapping Configuration
        3. 2.1.5.3 Power
          1. 2.1.5.3.1 Power Requirement
          2. 2.1.5.3.2 Power Input
        4. 2.1.5.4 Emulator Connector (TSW-106-16-G-D) and DAC Connector (TSW-102-16-G-D)
          1. 2.1.5.4.1 TSW-106-16-G-D
          2. 2.1.5.4.2 TSW-102-16-G-D
        5. 2.1.5.5 FSI Header
        6. 2.1.5.6 High Density Connector
          1. 2.1.5.6.1 180-pin HSEC Edge Connector
        7. 2.1.5.7 Use Case for HSEC Adapter Board
          1. 2.1.5.7.1 Case 1: Isolated XDS110 on HSEC Adapter, SOM ,Baseboard
          2. 2.1.5.7.2 Case 2: HSEC Adapter, Isolated XDS110 on SOM, Baseboard
  7. 3Hardware Design Files
  8. 4Additional Information
    1. 4.1 Trademarks

2.1.5.3 Power