SPRAA99C March   2008  – May 2021 AM3351 , AM3352 , AM3354 , AM3356 , AM3357 , AM3358 , AM3359 , AM4372 , AM4376 , AM4377 , AM4378 , AM4379 , OMAPL138B-EP , TMUX646

1.   Trademarks
2. 1Introduction
3. 2PCB Design Considerations
   1. 2.1 Solder Land Areas
   2. 2.2 Conductor Width/Spacing
   3. 2.3 High-Density Routing Techniques
   4. 2.4 Via Density
   5. 2.5 Conventional PCB Design
   6. 2.6 Advanced Design Methods
4. 3Reliability
   1. 3.1 Reliability Calculations
   2. 3.2 Package Characteristics
   3. 3.3 Thermal Modeling
5. 4Surface-Mounting nFBGA Packages
   1. 4.1 Design for Manufacturability (DFM)
   2. 4.2 Solder Paste
   3. 4.3 Solder Ball Collapse
   4. 4.4 Reflow
   5. 4.5 Inspection
6. 5Packing and Shipping
   1. 5.1 Tray Packing Method
   2. 5.2 Tape-and-Reel Packing Method
   3. 5.3 Tape Format
   4. 5.4 Device Insertion
   5. 5.5 Packaging Method
7. 6Sockets
   1. 6.1 The Design Challenge
   2. 6.2 Contacting the Ball
   3. 6.3 Pinch Contact
   4. 6.4 Micro Tuning Fork Contact
   5. 6.5 Texas Instruments Sockets
8. 7Summary
9.   A Frequently Asked Questions
   1.     A.1 Package Questions
   2.     A.2 Assembly Questions
   3.     A.3 Small Body nFBGA Package Questions
10.   B Package Data Sheets
11.   C Thermal Modeling Results
12.   Revision History