SPRAAV1C May   2009  – March 2020 AM3703 , AM3715 , OMAP3503 , OMAP3515 , OMAP3525 , OMAP3530

1.   PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I
   1.     Trademarks
   2. 1  Using This Guide
   3. 2  A Word of Caution
   4. 3  A Team Sport
   5. 4  Be Wary of Quotes
   6. 5  Don’t Forget Your CAD Tools
   7. 6  Metric Vs English
   8. 7  PCB Fab Limits
   9. 8  Routing and Layer Stackup
   10. 9  OMAP35x 0.4mm Pitch
   11. 10 Pad Type
   12. 11 PCB Pad Dimensions for 0.4mm BGA Package
   13. 12 Multiple BGA Packages
   14. 13 Etch Traps and Heat Sinks
   15. 14 Vias and VIP
   16. 15 Laser Blind Vias
   17. 16 Filled Vias
   18. 17 Know Your Tools
   19. 18 BeagleBoard
   20. 19 BeagleBoard Views
       1. 19.1 Top Layer – Signal - Area Underneath the OMAP35x
       2. 19.2 Layer 2 – Ground
       3. 19.3 Layer 3 – Signal
       4. 19.4 Layer 4 – Signal
       5. 19.5 Layer 5 – Power (VDD2)
       6. 19.6 Layer 6 – Signal – Bottom Copper – Bottom Component Outlines
   21. 20 OMAP35x Decoupling
   22. 21 PCB Finishes for High Density Interconnect (HDI)
   23. 22 Real World Second Opinion
   24. 23 Acknowledgments
   25. 24 References
2.   Revision History