SPRAC21A June 2016 – June 2019 OMAP-L132 , OMAP-L138 , TDA2E , TDA2EG-17 , TDA2HF , TDA2HG , TDA2HV , TDA2LF , TDA2P-ABZ , TDA2P-ACD , TDA2SA , TDA2SG , TDA2SX , TDA3LA , TDA3LX , TDA3MA , TDA3MD , TDA3MV
IPU Subsystem, Figure 29, is the name used to designate the hardware that includes the following components: Dual ARM Cortex-M4 CPUs, Level 1 Unicache, L1 MMU, L2 MMU, L2 ROM, L2 RAM, and interconnect.
Main features of IPU subsystem:
NOTE
The 32-bit Master ISS OCP port and ISS bridge in Figure 29 are not available in the TDA2xx and TDA2ex class of devices.