SPRAC21A June 2016 – June 2019 OMAP-L132 , OMAP-L138 , TDA2E , TDA2EG-17 , TDA2HF , TDA2HG , TDA2HV , TDA2LF , TDA2P-ABZ , TDA2P-ACD , TDA2SA , TDA2SG , TDA2SX , TDA3LA , TDA3LX , TDA3MA , TDA3MD , TDA3MV
The EMIF module provides connectivity between DDR2 or DDR3 types of memories and manages data bus read/write accesses between external memories and device subsystems which have master access to the L3_MAIN interconnect and DMA capability. EMIF supports JEDEC standard-compliant DDR2-SDRAM and DDR3-SDRAM memory types.
Supported CAS latencies are:
This section compares the performance of DDR2 and DDR3 for a single initiator (System EDMA) and multiple initiators that try to simulate an actual use-case scenario.
The following configurations were used to test the DDR2 performance versus the DDR3 performance: