SPRACJ6A October   2018  – December 2022 AM6526 , AM6528 , AM6546 , AM6548

 

  1.   Trademarks
  2. 1 Introduction
    1. 1.1 Before Getting Started
    2. 1.2 Device (Processor) Selection
    3. 1.3 Technical Documentation
    4. 1.4 Design Documentation
  3. 2 System Block Diagram
    1. 2.1 Creating the System Block Diagram
    2. 2.2 Selecting the Boot Mode
    3. 2.3 Confirming Pin Multiplexing Compatibility
  4. 3 Power Supply
    1. 3.1 Power (Supply) Rails
      1. 3.1.1 Internal LDOs for IO groups
      2. 3.1.2 Dual-Voltage LVCMOS I/Os
      3. 3.1.3 Dual-Voltage Switching SDIO I/Os
    2. 3.2 Determining System Power Requirements
    3. 3.3 Power Supply Filters
    4. 3.4 Power Supply Decoupling and Bulk Capacitors
    5. 3.5 Power Supply Sequencing
  5. 4 Clocking
    1. 4.1 System Clock Inputs
    2. 4.2 Single-Ended Clock Sources
    3. 4.3 Unused Clock Inputs
  6. 5 JTAG
    1. 5.1 JTAG / Emulation
      1. 5.1.1 Configuration of JTAG / Emulation
      2. 5.1.2 System Implementation of JTAG / Emulation
      3. 5.1.3 JTAG Termination
  7. 6 Device Configurations and Initialization
    1. 6.1 Device Reset
    2. 6.2 Boot Modes
    3. 6.3 Watchdog Timer
  8. 7 Peripherals
    1. 7.1 Selecting Peripherals Across Functional Domains
    2. 7.2 Ethernet Interface
    3. 7.3 Programmable Real-Time Unit and Industrial Communication Subsystem - Gigabit (PRU-ICSSG)
    4. 7.4 Universal Serial Bus (USB) Subsystem
  9. 8 I/O Buffers and Termination
  10. 9 Power Consumption and Thermal Solutions
    1. 9.1 Power Consumption
    2. 9.2 Power Savings Modes
    3. 9.3 Guidance on Thermal Solution
  11. 10Schematic Recommendations
    1. 10.1 Selection of Component and Values
    2. 10.2 Schematics Development
    3. 10.3 Reviewing the Schematics
    4. 10.4 Floor planning of the PCB
  12. 11Layout and Routing Guidelines
    1. 11.1 Escape Routing Guidelines
    2. 11.2 DDR Board Design and Layout Guidelines
    3. 11.3 High-Speed Differential Signal Routing Guidance
  13. 12Terminology
  14. 13References
  15. 14Revision History

9.3 Guidance on Thermal Solution

The Thermal Design Guide for DSP and Arm Application Processors application report provides guidance for successful implementation of a thermal solution for system designs containing this device. This document provides background information on common terms and methods related to thermal solutions. TI only supports designs that follow system design guidelines contained in the application report.

For more information, see AM654x Thermal Model.