SPRACJ6A October   2018  – December 2022 AM6526 , AM6528 , AM6546 , AM6548

 

  1.   Trademarks
  2. 1 Introduction
    1. 1.1 Before Getting Started
    2. 1.2 Device (Processor) Selection
    3. 1.3 Technical Documentation
    4. 1.4 Design Documentation
  3. 2 System Block Diagram
    1. 2.1 Creating the System Block Diagram
    2. 2.2 Selecting the Boot Mode
    3. 2.3 Confirming Pin Multiplexing Compatibility
  4. 3 Power Supply
    1. 3.1 Power (Supply) Rails
      1. 3.1.1 Internal LDOs for IO groups
      2. 3.1.2 Dual-Voltage LVCMOS I/Os
      3. 3.1.3 Dual-Voltage Switching SDIO I/Os
    2. 3.2 Determining System Power Requirements
    3. 3.3 Power Supply Filters
    4. 3.4 Power Supply Decoupling and Bulk Capacitors
    5. 3.5 Power Supply Sequencing
  5. 4 Clocking
    1. 4.1 System Clock Inputs
    2. 4.2 Single-Ended Clock Sources
    3. 4.3 Unused Clock Inputs
  6. 5 JTAG
    1. 5.1 JTAG / Emulation
      1. 5.1.1 Configuration of JTAG / Emulation
      2. 5.1.2 System Implementation of JTAG / Emulation
      3. 5.1.3 JTAG Termination
  7. 6 Device Configurations and Initialization
    1. 6.1 Device Reset
    2. 6.2 Boot Modes
    3. 6.3 Watchdog Timer
  8. 7 Peripherals
    1. 7.1 Selecting Peripherals Across Functional Domains
    2. 7.2 Ethernet Interface
    3. 7.3 Programmable Real-Time Unit and Industrial Communication Subsystem - Gigabit (PRU-ICSSG)
    4. 7.4 Universal Serial Bus (USB) Subsystem
  9. 8 I/O Buffers and Termination
  10. 9 Power Consumption and Thermal Solutions
    1. 9.1 Power Consumption
    2. 9.2 Power Savings Modes
    3. 9.3 Guidance on Thermal Solution
  11. 10Schematic Recommendations
    1. 10.1 Selection of Component and Values
    2. 10.2 Schematics Development
    3. 10.3 Reviewing the Schematics
    4. 10.4 Floor planning of the PCB
  12. 11Layout and Routing Guidelines
    1. 11.1 Escape Routing Guidelines
    2. 11.2 DDR Board Design and Layout Guidelines
    3. 11.3 High-Speed Differential Signal Routing Guidance
  13. 12Terminology
  14. 13References
  15. 14Revision History

11.3 High-Speed Differential Signal Routing Guidance

The High-Speed Interface Layout Guidelines application report provides guidance for successful routing of the high-speed differential signals. This includes PCB stack-up and materials guidance as well as routing skew, length, and spacing limits. TI supports only designs that follow the board design guidelines contained in the application report.