SPRACL7 March   2019 AM5746 , AM5748 , AM5749

 

  1.   AM574x thermal considerations
    1.     Trademarks
    2. 1 Overview
    3. 2 Important Notes
    4. 3 Test Overview
      1. 3.1 OS Idle
      2. 3.2 Dhrystone
      3. 3.3 Temperature Measurement
      4. 3.4 OPP Definitions
    5. 4 Data and Results
      1. 4.1 OPP Settings and Linux Thermal Framework
      2. 4.2 Power and Thermal Chamber Measurements
      3. 4.3 OS Idle at OPP_NOM
      4. 4.4 Dhrystone 1 Core at OPP_NOM
      5. 4.5 Dhrystone 2 Core at OPP_NOM
      6. 4.6 Dhrystone 1 Core at OPP_HIGH
      7. 4.7 Dhrystone 2 Core at OPP_HIGH
    6. 5 References

1 Overview

In this experiment, an internal AM574x board is used to gather thermal data with different processor loading and ambient temperature. Ambient temperature is controlled with a programmable environmental chamber.

The collected data can be utilized to correlate the thermal performance of the processor and power consumption at a given processor load and junction temperature, based on ambient temperature and thermal management.

Tests were repeated with the following thermal management:

  • Bare package (no heatsink)
  • Low-cost heatsink (31-mm x 31-mm x 19.5-mm, #ATS-54310R-C1-R0)
  • Low-cost heatsink + Fan (5 V, 9500 RPM, 4.9 CFM, #MC30060V1-000U-A99)