SPRACL7 March   2019 AM5746 , AM5748 , AM5749

 

  1.   AM574x thermal considerations
    1.     Trademarks
    2. 1 Overview
    3. 2 Important Notes
    4. 3 Test Overview
      1. 3.1 OS Idle
      2. 3.2 Dhrystone
      3. 3.3 Temperature Measurement
      4. 3.4 OPP Definitions
    5. 4 Data and Results
      1. 4.1 OPP Settings and Linux Thermal Framework
      2. 4.2 Power and Thermal Chamber Measurements
      3. 4.3 OS Idle at OPP_NOM
      4. 4.4 Dhrystone 1 Core at OPP_NOM
      5. 4.5 Dhrystone 2 Core at OPP_NOM
      6. 4.6 Dhrystone 1 Core at OPP_HIGH
      7. 4.7 Dhrystone 2 Core at OPP_HIGH
    6. 5 References

4.2 Power and Thermal Chamber Measurements

The tables shown in the following sections contain power consumption and junction temperature measured running OS Idle and Dhrystone single-core use-cases at different controlled ambient temperatures with and without an attached heatsink. This silicon process type is nominal. Dhrystone tests are repeated with MPU at each supported OPP.

Junction temperature and power reported in the following sections are sampled at the same time, and are presented in separate tables to aid comprehension.