• Menu
  • Product
  • Email
  • PDF
  • Order now

  • AM273x Hardware Design Guide

    • SPRAD61A March   2023  – November 2023 AM2732 , AM2732 , AM2732-Q1 , AM2732-Q1

       

  • CONTENTS
  • SEARCH
  • AM273x Hardware Design Guide
  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 Acronyms
  5. 2 Power
    1. 2.1 Discrete DC-DC Power Solution
    2. 2.2 Integrated PMIC Power Solution
    3. 2.3 Power Decoupling and Filtering
    4. 2.4 Power Consumption
  6. 3 Clocking
    1. 3.1 Crystal and Oscillator Input Options
    2. 3.2 Output Clock Generation
    3. 3.3 Crystal Selection and Shunt Capacitance
    4. 3.4 Crystal Placement and Routing
  7. 4 Resets
  8. 5 Bootstrapping
    1. 5.1 SOP Signal Implementation
    2. 5.2 QSPI Memory Controller Implementation
    3. 5.3 ROM QSPI Boot Requirements
  9. 6 JTAG Emulators and Trace
  10. 7 Multiplexed Peripherals
  11. 8 Digital Peripherals
    1. 8.1 General Digital Peripheral Routing Guidelines
  12. 9 Layer Stackup
    1. 9.1 TMDS273GPEVM Layer Stackup
      1. 9.1.1 TMDS273GPEVM Key Stackup Features
    2. 9.2 Four Layer ZCE Example Layer Stackup
      1. 9.2.1 ZCE Four Layer Example Key Stackup Features
    3. 9.3 Four Layer NZN Example Layer Stackup
      1. 9.3.1 NZN Four Layer Example Key Stackup Features
  13. 10Vias
  14. 11BGA Power Fan-Out and Decoupling Placement
    1. 11.1 Ground Return
      1. 11.1.1 Ground Return - TMDS273GPEVM
      2. 11.1.2 Ground Return - ZCE Four Layer Example
      3. 11.1.3 Ground Return - NZN Four Layer Example
    2. 11.2 1.2 V Core Digital Power
      1. 11.2.1 1.2 V Core Digital Power Key Layout Considerations
        1. 11.2.1.1 1.2V Core Layout - TMDS273GPEVM
        2. 11.2.1.2 1.2V Core Layout - ZCE Four Layer Example
        3. 11.2.1.3 1.2V Core Layout - NZN Four Layer Example
    3. 11.3 3.3 V Digital and Analog Power
      1. 11.3.1 3.3 V Digital and Analog Power Key Layout Considerations
        1. 11.3.1.1 3.3V Digital and Analog Layout - TMDS273GPEVM
        2. 11.3.1.2 3.3V Digital and Analog Layout - ZCE Four Layer Example
        3. 11.3.1.3 3.3V Digital and Analog Layout - NZN Four Layer Example
    4. 11.4 1.8 V Digital and Analog Power
      1. 11.4.1 1.8 V Digital and Analog Power Key Layout Considerations
        1. 11.4.1.1 1.8V Digital and Analog Layout - TMDS273GPEVM
        2. 11.4.1.2 1.8V Digital and Analog Layout - ZCE Four Layer Example
        3. 11.4.1.3 1.8V Digital and Analog Layout - NZN Four Layer Example
  15. 12References
  16. 13Revision History
  17. IMPORTANT NOTICE
search No matches found.
  • Full reading width
    • Full reading width
    • Comfortable reading width
    • Expanded reading width
  • Card for each section
  • Card with all content

 

Application Note

AM273x Hardware Design Guide

Abstract

This application note intends to serve as a guide for hardware designers creating PCB systems based on the AM273x family of MCU devices. This document serves to integrate device-specific schematic and PCB layout recommendations and examples from the AM273x evaluation modules (EVM), the TMDS273GPEVM, with the AM273x Sitara™ Microcontroller Data Sheet, AM273x Sitara™ Microcontroller Technical Reference Manual and other collateral documents and tools, as shown in Section 12.

Project collateral and source code discussed in this application note can be downloaded from the following link https://www.ti.com/lit/zip/sprad61.

Trademarks

All trademarks are the property of their respective owners.

1 Introduction

The AM273x family of microcontrollers is a highly-integrated, high performance microcontroller based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables Original-Equipment Manufacturers (OEM) and Original-Design Manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance, through the maximum flexibility of a fully integrated, mixed processor solution. A typical AM273x based design is shown in Figure 1-1. This diagram is excerpted from the AM273x EVM (TMDS273GPEVM) system block diagram. As can be seen below the AM273x devices offer designers a wide range of digital connectivity, audio, radar and analog sensor feedback options.

GUID-D4771BEA-B0B9-426C-8D2A-4EB688F2602E-low.png Figure 1-1 Typical AM273x System Block Diagram (Based on TMDS273GPEVM Design)

To quickly achieve a working system with the numerous cores peripherals and pin multiplexing options available on the AM273x MCU, this document should be referenced along with the other key AM273x collateral references. These include:

  • The AM273x Sitara™ Microcontroller Data Sheet [1] is the primary resource for all device pinout and pin-level multiplexing options.
  • The SYSCONFIG [4] pinmux planning tool should be utilized when starting a new AM273x pinout and driver utilization.
  • The AM273x Sitara™ Microcontroller Technical Reference Manual [2] documents detail each core and peripheral subsystem from a conceptual, usage and programming model perspective.
  • The AM273x MCU-SDK [7] ties the data sheet and technical reference manual together with software system and peripheral usage examples.

1.1 Acronyms

Table 1-1 Acronyms Used in This Document
Acronym Description
EVM Evaluation Module. Referencing TI PCB assemblies such as the AM273x GP EVM (TMDS273GPEVM)
PDN Power Distribution Network. The active and passive components providing regulated power to a load such as the AM273x MCU power pins.
EMI Electromagnetic Interference
PI Power Integrity
SI Signal Integrity
BOM Bill of Materials

 
Texas Instruments

© Copyright 1995-2025 Texas Instruments Incorporated. All rights reserved.
Submit documentation feedback | IMPORTANT NOTICE | Trademarks | Privacy policy | Cookie policy | Terms of use | Terms of sale