SPRAD66B February   2023  – December 2024 AM62A3 , AM62A3-Q1 , AM62A7 , AM62A7-Q1 , AM62D-Q1 , AM62P , AM62P-Q1

 

  1.   1
  2.    AM62Ax, AM62Px, AM62Dx LPDDR4 Board Design and Layout Guidelines
  3.   Trademarks
  4. 1Overview
    1. 1.1 Board Designs Supported
    2. 1.2 General Board Layout Guidelines
    3. 1.3 PCB Stack-Up
    4. 1.4 Bypass Capacitors
      1. 1.4.1 Bulk Bypass Capacitors
      2. 1.4.2 High-Speed Bypass Capacitors
    5. 1.5 Velocity Compensation
  5. 2LPDDR4 Board Design and Layout Guidance
    1. 2.1  LPDDR4 Introduction
    2. 2.2  LPDDR4 Device Implementations Supported
    3. 2.3  LPDDR4 Interface Schematics
    4. 2.4  Compatible JEDEC LPDDR4 Devices
    5. 2.5  Placement
    6. 2.6  LPDDR4 Keepout Region
    7. 2.7  Net Classes
    8. 2.8  LPDDR4 Signal Termination
    9. 2.9  LPDDR4 VREF Routing
    10. 2.10 LPDDR4 VTT
    11. 2.11 CK and ADDR_CTRL Topologies
    12. 2.12 Data Group Topologies
    13. 2.13 CK0 and ADDR_CTRL Routing Specification
    14. 2.14 Data Group Routing Specification
    15. 2.15 Channel, Byte, and Bit Swapping
    16. 2.16 Data Bus Inversion
  6. 3LPDDR4 Board Design Simulations
    1. 3.1 Board Model Extraction
    2. 3.2 Board-Model Validation
    3. 3.3 S-Parameter Inspection
    4. 3.4 Time Domain Reflectometry (TDR) Analysis
    5. 3.5 System Level Simulation
      1. 3.5.1 Simulation Setup
      2. 3.5.2 Simulation Parameters
      3. 3.5.3 Simulation Targets
        1. 3.5.3.1 Eye Quality
        2. 3.5.3.2 Delay Report
        3. 3.5.3.3 Mask Report
    6. 3.6 Design Example
      1. 3.6.1 Stack-Up
      2. 3.6.2 Routing
      3. 3.6.3 Model Verification
      4. 3.6.4 Simulation Results
  7. 4Additional Information: SOC Package Delays
  8. 5Summary
  9. 6References
  10. 7Revision History

5 Summary

This application report describes how to plan, route, and simulate a PCB for successful LPDDR4 operation on AM62Ax, AM62Px, AM62Dx processor designs. Topics include board layout guidelines, board stackup, supported implementations, schematics, component placement, and trace length matching targets. Specifications are provided for the clock and address or control signal group and data group topologies. Designing to these metrics helps to achieve a board layout with first-pass success. The simulation section of this application report documents a procedure for confirming the layout meets the requirements for a robust system before board fabrication. The topics of board model extraction, drive-strength and termination optimization, system-level simulation, and eye mask minimums are presented with examples from actual board designs.