SPRAD96B November   2023  – January 2024 AM62P , AM62P-Q1

 

  1.   1
  2.   Trademarks
  3. Introduction
  4. Via Channel Arrays
  5. Width/Spacing Proposal for Escapes
  6. Stackup
  7. Via Sharing
  8. Floorplan Component Placement
  9. Critical Interfaces Impact Placement
  10. Routing Priority
  11. SerDes Interfaces
  12. 10DDR Interfaces
  13. 11Power Decoupling
  14. 12Route Lowest Priority Interfaces Last
  15. 13Summary
  16. 14Revision History

SerDes Interfaces

The package BGA ball map is also arranged to support routing the higher priority interfaces first. Therefore, the SerDes CSI and DSI interfaces are located towards the outer two rings. The differential receive pair should be routed away from the SoC on the top layer leaving a gap without blocking vias. The lanes located on inner BGA rows require vias to escape as a differential pair on the bottom or on an interior layer. The VCA facilitates this for inner rows. See Figure 9-1 for an example of the escape of the SerDes signals on the AM62Px board on the top layer and on an inner layer. Wide traces can limit the signal loss but could violate the impedance requirements. For more detailed information on routing SerDes signals, refer to the document on High-Speed Interface Layout Guidelines.

GUID-52124217-5889-4174-992E-E20127FB54BA-low.png Figure 9-1 Serdes CSI Escapes for TOP layer (Left) and Inner layer (Right)