SPRADA9A
December 2023 – August 2024
AM62P
,
AM62P-Q1
1
ABSTRACT
Trademarks
1
Introduction
1.1
Before Getting Started With the Custom Board Design
1.2
Processor Selection
1.3
Technical Documentation
1.3.1
Updated Schematics With Design, Review and Cad Notes Added
1.3.2
FAQs to Support Custom Board Design
1.4
Design Documentation
2
Block Diagram
2.1
Constructing the Block Diagram
2.2
Configuring the Boot Mode
2.3
Confirming PinMux (PinMux Configuration)
3
Power Supply
3.1
Power Supply Architecture
3.1.1
Integrated Power
3.1.2
Discrete Power
3.2
Power (Supply) Rails
3.2.1
Core Supply
3.2.2
Peripheral Power Supply
3.2.3
Dynamic Switching Dual-Voltage IO Supply
3.2.4
Internal LDOs for IO Groups (Processor)
3.2.5
Dual-Voltage IOs (for Processor IO Groups)
3.2.6
VPP (eFuse ROM Programming) Supply
3.3
Determining Board Power Requirements
3.4
Power Supply Filters
3.5
Power Supply Decoupling and Bulk Capacitors
3.5.1
Note on PDN Target Impedance
3.6
Power Supply Sequencing
3.7
Supply Diagnostics
3.8
Power Supply Monitoring
4
Clocking
4.1
Processor External Clock Source
4.1.1
Unused WKUP_LFOSC0
4.1.2
LVCMOS Digital Clock Source
4.1.3
Crystal Selection
4.2
Processor Clock Outputs
5
JTAG (Joint Test Action Group)
5.1
JTAG / Emulation
5.1.1
Configuration of JTAG / Emulation
5.1.2
Implementation of JTAG / Emulation
5.1.3
Connection of JTAG Interface Signals
6
Configuration (Processor) and Initialization (Processor and Device)
6.1
Processor Reset
6.2
Latching of Boot Mode Configuration
6.3
Resetting the Attached Devices
6.4
Watchdog Timer
7
Processor Peripherals
7.1
Selecting Peripherals Across Domains
7.2
Memory (DDRSS)
7.2.1
Processor DDR Subsystem and Device Register Configuration
7.2.2
Calibration Resistor Connection
7.3
Media and Data Storage Interfaces
7.4
Common Platform Ethernet Switch 3-port Gigabit (CPSW3G - for Ethernet Interface)
7.5
Programmable Real-Time Unit Subsystem (PRUSS)
7.6
Universal Serial Bus (USB) Subsystem
7.7
General Connectivity Peripherals
7.8
Display Subsystem (DSS)
7.9
Camera Subsystem (CSI)
7.10
Connection of Processor Power Supply Pins, Unused Peripherals and IOs
7.10.1
External Interrupt (EXTINTn)
7.10.2
Reserved Pins (Signals)
8
Interfacing of Processor IOs ( LVCMOS or Open-Drain or Fail-Safe Type IO Buffers) and Simulations
9
Power Consumption and Thermal Analysis
9.1
Power Estimation
9.2
Maximum Current for Different Supply Rails
9.3
Power Modes
9.4
Thermal Design Guidelines
10
Schematic Design, Capture, Entry and Review
10.1
Selection of Components and Values
10.2
Schematic Design and Capture
10.3
Schematics Review
11
Floor Planning, Layout, Routing Guidelines, Board Layers and Simulation
11.1
Escape Routing for PCB Design
11.2
LPDDR4 Design and Layout Guidelines
11.3
High-Speed Differential Signal Routing Guidelines
11.4
Board Layer Count and Stack-up
11.4.1
Simulation Recommendations
11.5
Reference for Steps to be Followed for Running Simulation
12
Board Assembly and Bring-up
13
Device Handling and Assembly
13.1
Soldering Recommendations
13.1.1
Additional References
14
References
14.1
Processor Specific
14.2
Common
15
Terminology
16
Revision History
7.5
Programmable Real-Time Unit Subsystem (PRUSS)
The processor family does not support PRUSS.