|
|
°C/W(1) |
AIR FLOW (lfm)(2) |
RΘJC |
Junction-to-case thermal
resistance |
6.97 |
N/A |
RΘJB |
Junction-to-board thermal
resistance |
6.05 |
N/A |
RΘJA (High k
PCB) |
Junction-to-free air thermal
resistance |
17.8 |
0 |
RΘJMA |
Junction-to-moving air
thermal resistance |
12.8 |
150 |
11.4 |
250 |
10.1 |
500 |
PsiJT |
Junction-to-package
top |
0.11 |
0 |
0.24 |
150 |
0.33 |
250 |
0.42 |
500 |
PsiJB |
Junction-to-board |
6.1 |
0 |
5.5 |
150 |
5.4 |
250 |
5.3 |
500 |
(1) These values are based on a JEDEC-defined 2S2P system (with
the exception of the Theta JC [RΘ
JC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as
application. For more information, see these EIA/JEDEC standards:
- JESD51-2, Integrated
Circuits Thermal Test Method Environmental Conditions - Natural
Convection (Still Air)
- JESD51-3, Low
Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages
- JESD51-7, High
Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages
- JESD51-9, Test Boards
for Area Array Surface Mount Package Thermal Measurements
(2) lfm = linear feet per minute