It is recommended to perform thermal simulations at the system level
with the worst case device power consumption.NO. | PARAMETER | DESCRIPTION | ALF PACKAGE |
---|
°C/W(1)(3) | AIR FLOW (m/s)(2) |
---|
T1 | RΘJC | Junction-to-case | 0.25 | N/A |
T2 | RΘJB | Junction-to-board | 2.1 | N/A |
T3 | RΘJA | Junction-to-free air | 11.5 | 0 |
T4 | Junction-to-moving air | 7.4 | 1 |
T5 | 6.5 | 2 |
T6 | 6 | 3 |
T7 | ΨJT | Junction-to-package top | 0.1 | 0 |
T8 | 0.1 | 1 |
T9 | 0.1 | 2 |
T10 | 0.1 | 3 |
T11 | ΨJB | Junction-to-board | 1.6 | 0 |
T12 | 1.7 | 1 |
T13 | 1.6 | 2 |
T14 | 1.5 | 3 |
(1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
- JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
- JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
- JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
- JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
- JESD51-9, Test Boards for Area Array Surface Mount Packages
(2) m/s = meters per second.
(3) °C/W = degrees Celsius per watt.