SPRSP98A November   2023  – June 2024 AM625SIP

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
    1. 3.1 Functional Block Diagram
  5. Device Comparison
    1. 4.1 Related Products
  6. Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes and Signal Descriptions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Operating Performance Points
    5. 6.5 Thermal Resistance Characteristics
      1. 6.5.1 Thermal Resistance Characteristics for AMK Package
    6. 6.6 Timing and Switching Characteristics
      1. 6.6.1 Power Supply Requirements
        1. 6.6.1.1 Power Supply Sequencing
  8. Applications, Implementation, and Layout
    1. 7.1 Peripheral- and Interface-Specific Design Information
      1. 7.1.1 Integrated LPDDR4 SDRAM Information
  9. Device and Documentation Support
    1. 8.1 Device Nomenclature
      1. 8.1.1 Standard Package Symbolization
      2. 8.1.2 Device Naming Convention
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Pin Attributes and Signal Descriptions

This section describes the AM625SIP device pins which have different power or signal functions relative to the ALW packaged AM6254 device. The AM6254 DDRSS0 signals in the ALW package that would normally connect to an external SDRAM were connected directly to an integrated LPDDR4 SDRAM in the AM625SIP device, and the pins associated with these signals were reassigned to different power or signal functions. Table 5-1 contains a list of ball numbers that were reassigned to new power or signal functions along with their new ball name and signal description.

Table 5-1 Reassigned DDRSS0 Pins on the AMK Package
BALL
NUMBER
BALL NAME Signal Description
M9 VDDS_DDR DDR PHY IO supply
F2 VDDS_MEM_1P1 SDRAM IO supply
(Sources the SDRAM VDD2 and VDDQ power rails)
G2
H1
H2
N1
N2
P2
R2
U1
U2
V2
W2
M4 VDDS_MEM_1P8 SDRAM Core supply
(Sources the SDRAM VDD1 power rail)
N3
R3 DDR_ZQ SDRAM Calibration Reference(1)
(Connects to the SDRAM ZQ Calibration Reference)
E1 VSS Ground
(Connects to the SDRAM VSS and VSSQ grounds)
E2
E3
F1
F3
F4
G5
H5
H6
J1
J2
J3
J4
K1
K2
K3
K4
L1
L2
L5
L6
M1
M5
N6
P1
P4
P5
R1
R5
R6
T1
T4
U3
V1
V5
V6
W1
W5
Y1
An external 240 Ω ±1% resistor must be connected between this pin and VDDS_MEM_1P1. The maximum power dissipation for the resistor is 8.33 mW.