Table 1 lists names of the folders and file names in the folders along with the format for all the files that have been included in the TMDS64EVM. The TMDS64 evaluation module (EVM) is a stand-alone test and development platform great for accelerating the prototype phase of your next design. TMDS64EVM is equipped with a Sitara™ AM6442 processor, along with additional components that allow the user to make use of various device interfaces, including industrial Ethernet, standard Ethernet, peripheral component interconnect express (PCIe), fast serial interface (FSI), and others to easily create prototypes. The product overview document is available on TMDS64EVM product folder on TI.com for customers to review before downloading the single Zip folder.
| Folder (1st level) | Folder (2nd level) | Files Inside | File type |
|---|---|---|---|
| ---- | ---- | Proc101D_Folders_Files_List | XLS |
| 1_SCHEMATIC | PROC101D_SCH_With_Design_Updates..Notes_V1.0 | ||
| PDF -Backup_SK_Schematic | PROC101D(004)_SCH | ||
| ---- | Proc101D_Schematic_Revision_Readme | DOC | |
| ORCAD | PROC101D_SCH_With_Design_Updates..Notes_V1.0 | DSN | |
| ORCAD - Backup_SK_Schematic | PROC101D_SCH | DSN | |
| 2_BOM | ---- | PROC101D_BOM_With_Design_Updates..Notes_V1.0 | XLS |
| Backup_SK_Schematic_BOM | PROC101D(004)_BOM | XLS | |
| 3_Board_File | Allegro | PROC101D_BRD | BRD |
| Simulation Scorecard | AM64x_Simulations_Scorecard | ||
| Altium_ASCII | PROC101D_BRD | ALG | |
| 4_Gerber | ODBGBR | PROC101D_ODBGBR | ZIP |
| 274X | PROC101D_RS274GBR | ZIP | |
| IPC-D-356_NETLIST | PROC101D_BRD | IPC | |
| 5_Gerber_PDF | FAB | PROC101D_FAB | |
| PCB LAYERS | PROC101D_ALL_LAYERS | ||
| Geber Layers | PROC101D_ALL_LAYERS | ||
| 6_Assembly_Models_Package | 2D | PROC101D_DXF_BASY | DXF |
| PROC101D_DXF_TASY | DXF | ||
| 3D | PROC101D_3D.STEP | STP | |
| IDF | PROC101D_BRD | EMP | |
| PROC101D_BRD | EMN | ||
| Assembly_Drawing | PROC101D_ASSY | ||
| PROC101D_TASY | |||
| PROC101D_BASY | |||
| STNL | art_aper + 8 x .ART files | ART | |
| XY-REP | PROC101D_XYREP | XLS | |
| 7_PCB_LAYER_STACKUP | --- | TMDS64EVM_PROC101_Stack_up | |
| 8_Power_Supply_Sequencing | --- | --- NA ---- |
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2024, Texas Instruments Incorporated