The DRA75x, DRA74x is a high-performance, infotainment application device, based on enhanced
OMAP™ architecture integrated on a 28-nm technology.
- The architecture is designed for advanced graphical HMI and Navigation, Digital and Analog Radio, Rear Seat Entertainment and Multimedia playback, providing Advanced Driver Assistance integration capabilities with Video analytics support, and best-in-class CPU performance, video, image, and graphics processing sufficient to support, among others:
- Streaming video up to full high definition (Full-HD) (1920×1080p, 60 fps)
- 2-dimensional (2D) and 3-dimensional (3D) graphics and composition
- Decode of digital radio standards (DAB,
HD Radio™), and analog AM/FM/RDS radio
- Efficient web browsing
Note: The supported set of features and peripherals is device part number dependent. Refer to device-specific Data Manual, for more information.
Note:
TI limits support for this family of SoCs to features that are supported via
Software Development Kits (SDK). The SDK “build sheet” is available for download
as part of each SDK and should be referenced to understand the subset of SoC
hardware functionality that is available in software:
https://www.ti.com/tool/PROCESSOR-SDK-TDAX
- The device is composed of the following subsystems:
- Cortex®-A15 microprocessor unit (MPU) subsystem, including two
ARM® Cortex-A15 cores
- Two Digital Signal Processor (DSP) C66x subsystems
- Image and video accelerator high-definition (IVA-HD) subsystem
- Two
Cortex®-M4 image processing unit (IPU) subsystems, each including two ARM Cortex-M4 microprocessors available for general purpose usage
- Two Embedded Vision Engine (EVE) subsystems
- Display subsystem (DSS)
- Video Processing subsystem (VPE)
- Video Input Capture (VIP)
- 3D-graphics processing unit (GPU) subsystem, including
POWERVR™ SGX544 dual-core
- 2D-graphics accelerator (BB2D) subsystem, including
Vivante™ GC320 core
- Three pulse-width modulation (PWM) subsystems
- Real-time clock (RTC) subsystem
- Debug subsystem
- The device provides a rich set of connectivity peripherals, including among others:
- One USB3.0 and three USB2.0 subsystems
- SATA 2 subsystem
- Two PCI Express Gen2 subsystems
- 3-port Gigabit Ethernet Switch subsystem
- Two Controller Area Network (DCAN) subsystems
- The device includes support for:
- Error Detection and Correction:
- Parity bit per byte on C66x DSP L1 program cache and Single-Error Correction Dual-Error Detection (SECDED) on L2 memories on the DSP
- SECDED on Large L3 memory
- EVE: Error detection for all internal data memories (DMEM, WBUF, IBUFLA, IBUFLB, IBUFHA, IBUFHB):
- Single bit error detection (parity bit per byte) on DMEM, WBUF and IBUFs
- Double bit error detection (distance 3, 10-bit hamming code) and parity on VCOP accesses to memory and working/image buffers in EVE
- SECDED on external DDR memory interface (EMIF1 only)
- MMU/MPU
- MMU used for key masters (Cortex-A15 MPU, Cortex-M4 IPU, C66x DSP, EVE, EDMA)
- Memory protection of C66x cores
- MMU inside the Dynamic Memory Manager
- The device includes state-of-the-art integrated power-management techniques required for high-performance infotainment products.
- The device also integrates:
- On-chip memory
- External memory interfaces
- Memory management
- Level 3 (L3) and level 4 (L4) interconnects
- System peripherals
- Car, audio and media peripherals
- Radio accelerators