SPRUI30H November 2015 – May 2024 DRA745 , DRA746 , DRA750 , DRA756
The key component of the C66x DSP subsystem is built on the TI's high performance TMS320C66x DSP CorePac which consists of a single TMS320C66x CPU (DSP_C0) processor along with a level 1 (L1P and L1D) cacheable SRAM and a level 2 (L2) cacheable SRAM memories interfaced via associated local L1P, L1D and L2 memory controllers, respectively. A DSP C66x CorePac includes also some other internal peripheral components, see Section 5.3.2.2.3 for details.
This chapter provides an overview of the DSP subsystem and the following considerations associated with it :
For more information on the TMS320C66x DSP CorePac, refer to the TMS320C66x DSP CorePac User Guide, ( SPRUGW0C), the TMS320C66x DSP Cache User Guide, ( SPRUGY8) and the TMS320C66x DSP CPU and Instruction Set Reference Guide, ( SPRUGH7).