SPRUI30H November 2015 – May 2024 DRA745 , DRA746 , DRA750 , DRA756
There are five temperature sensors on the device die. Each sensor is associated only with one voltage domain and is also a part of a VBGAPTS cell. This cell has a 10-bit ADC. The ADC converts the temperature values into digital output values proportional to the temperature measured. Each VBGAPTS cell is controlled by a dedicated FSM referred to as thermal FSM. The registers associated with each FSM reside in the CTRL_MODULE_CORE submodule. All FSMs are clocked by the L3INSTR_TS_GCLK clock. The PRCM module controlls this clock through the slave idle protocol.
The device thermal management related registers can be split into the following classes:
Figure 18-5 shows the block diagram of the device thermal management.
Table 18-7 describes the signals related to the device thermal management logic.
Signal | I/O(1) | Description |
---|---|---|
EOCZ | O | End of conversion signal. When low, this signal indicates that the value of DTEMP[9:0] is valid. |
DTEMP[9:0] | O | Temperature data from the temperature sensor. This value is valid when EOCZ is low. |
VBGAPTS CLK | I | Functional clock from the WKUPAON power domain used by the temperature sensor during temperature conversion. |
THERMAL ALERT | O | The five thermal alert outputs from each thermal FSM are ORed and then mapped as an interrupt request to the IRQ_CROSSBAR module. Software uses this interrupt to implement the device thermal management policy. |
TSHUT | O | Each of the five thermal shutdown signals is mapped to the PRCM and is used as a warm reset signal. These overheat protection signals are high during normal operation and go low during thermal shutdown event. |
The ADC values which correspond to the current temperature are listed in Table 18-10.