SPRUII1A November   2017  – January 2020

 

  1.   Fusion Application Board
    1.     Trademarks
    2. 1 Introduction
    3. 2 Overview
      1. 2.1 Fusion Application Board
      2. 2.2 Fusion Board Features
    4. 3 Hardware
      1. 3.1  Hardware Architecture
        1. 3.1.1 Fusion Application Board With Component Identification
      2. 3.2  TDAx EVM Compatibility
      3. 3.3  Fusion Power
      4. 3.4  DS90UB960 Modes
        1. 3.4.1 Power over Coax (PoC)
      5. 3.5  I2C Addressing
        1. 3.5.1 Multiple Device Addressing (Aliasing)
        2. 3.5.2 I2C Bus Switches and Connections
      6. 3.6  EVM Interface
      7. 3.7  Sensor Connection
      8. 3.8  MSP430™ Microcontroller
      9. 3.9  Configuration Options
        1. 3.9.1 Dipswitch (S3)
        2. 3.9.2 Bank 1 Power (J27)
        3. 3.9.3 Bank 2 Power (J22)
      10. 3.10 Status LEDs
      11. 3.11 External Interfaces
    5. 4 Image Sensor Module (Optional)
      1. 4.1 OV2775 Image Sensor
      2. 4.2 DS90UB953-Q1 Serializer
    6. 5 Getting Started
      1. 5.1 Powering Up the Fusion Application Board
  2.   Revision History

3.7 Sensor Connection

Two banks of connectors each support up to four sensors. One bank is coax only, the other is selectable between coax and HSD (see Figure 7).

Coaxial_HSD_Connectors.gifFigure 7. Coaxial and HSD Connectors Diagram

The coax cable can transmit both data and power over the same wire. However, the coax has limited power transfer capability. The HSD connection has separate data and power lines allowing more energy for power hungry sensors. To select between the HSD and Coax cable, switch S3 position 2 must be set. ON selects the coaxial cable. OFF selects the HSD twisted pair. For Bank1, all sensors must be configured for either coax or HSD (no mixing of the sensors). For the location of the switch set (S3), see Figure 3.