SPRUIW8 November   2020

 

  1.   Trademarks
  2. 1Board Overview
    1. 1.1 Kit Contents
    2. 1.2 Features
    3. 1.3 Specifications
    4. 1.4 Using the F28002x LaunchPad
    5. 1.5 BoosterPacks
    6. 1.6 Hardware Revisions
      1. 1.6.1 Revision A
  3. 2Software Development
    1. 2.1 Software Tools and Packages
    2. 2.2 F28002x LaunchPad Demo Program
    3. 2.3 Programming and Running Other Software on the F28002x LaunchPad
  4. 3Hardware Description
    1. 3.1 Functional Description and Connections
      1. 3.1.1  Microcontroller
      2. 3.1.2  LEDs
      3. 3.1.3  Encoder Connectors
      4. 3.1.4  FSI
      5. 3.1.5  CAN
      6. 3.1.6  CLB
      7. 3.1.7  Boot Modes
      8. 3.1.8  BoosterPack Headers
        1. 3.1.8.1 BoosterPack Sites
      9. 3.1.9  Analog Voltage Reference Header
      10. 3.1.10 Other Headers and Jumpers
        1. 3.1.10.1 USB Isolation Block
        2. 3.1.10.2 BoosterPack Site 2 Power Isolation
        3. 3.1.10.3 Alternate Power
        4. 3.1.10.4 5 V Step-up Converter
    2. 3.2 Debug Interface
      1. 3.2.1 XDS110 Debug Probe
      2. 3.2.2 XDS110 Output
      3. 3.2.3 Virtual COM Port
    3. 3.3 Alternate Routing
      1. 3.3.1 Overview
      2. 3.3.2 UART Routing
      3. 3.3.3 EQEP Routing
      4. 3.3.4 CAN Routing
      5. 3.3.5 FSI Routing
      6. 3.3.6 X1/X2 Routing
      7. 3.3.7 PWM DAC
      8. 3.3.8 Other GPIOs
  5. 4Board Design
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 BOM
    4. 4.4 LAUNCHXL-F280025C Board Dimensions
  6. 5Frequently Asked Questions
  7. 6References
    1. 6.1 Reference Documents
    2. 6.2 Other TI Components Used in This Design

3.1.10.1 USB Isolation Block

JP1, JP2, and JP3 are provided to enable isolation between the device and the connected USB in high-voltage applications. The area of isolation is defined by the white outline in the upper-left corner of the LaunchPad. JP1 separates the GND of USB region and the MCU region of the LaunchPad. JP2 separates 3.3 V, and JP3 separates 5 V. By default, all three jumpers are shorted and the power is supplied by the connected USB, meaning that the USB is NOT isolated from the MCU region. If power isolation is desired, remove the supplied shunts from JP1, JP2, and JP3. In this configuration, a 3.3 V supply must be connected to the MCU region to power the F280025C MCU and the other on-board circuitry, including the XDS110 debug probe. Some applications may not require 5 V to be supplied to the MCU region. In an isolated power application with JP3 removed, supplying 5 V to the MCU region is optional.