SPRUJ07 august   2023 TMS320F28075 , TMS320F28075-Q1 , TMS320F28076 , TMS320F28374D , TMS320F28374S , TMS320F28375D , TMS320F28375S , TMS320F28375S-Q1 , TMS320F28376D , TMS320F28376S , TMS320F28377D , TMS320F28377D-EP , TMS320F28377D-Q1 , TMS320F28377S , TMS320F28377S-Q1 , TMS320F28378D , TMS320F28378S , TMS320F28379D , TMS320F28379D-Q1 , TMS320F28379S , TMS320F28P650DH , TMS320F28P650DK , TMS320F28P650SH , TMS320F28P650SK , TMS320F28P659DH-Q1 , TMS320F28P659DK-Q1 , TMS320F28P659SH-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Feature Differences Between F2837x and F28P65x
    1. 1.1 F2837x and F28P65x Feature Comparison
  5. 2PCB Hardware Changes
    1. 2.1 PCB Hardware Changes for the 176-Pin PTP and 100-Pin PZP Package
    2. 2.2 Use of Existing 176-Pin F2837x PCB Design
      1.      9
      2. 2.2.1 JTAG TRSTn No-Connect
      3. 2.2.2 GPIO Input Buffer Control Register
      4. 2.2.3 176-Pin GPIO Pin/Multiplex and ADCD Considerations
        1. 2.2.3.1 176-Pin PTP Pins with Different GPIO Assignment
        2. 2.2.3.2 ADCD Channel Migration
    3. 2.3 176-Pin PTP New PCB Design
    4. 2.4 100-Pin PZP New PCB Design
    5. 2.5 337-BGA ZWT Application to 256-BGA ZEJ or 169-BGA NMR
  6. 3Feature Differences for System Consideration
    1. 3.1 New Features in F28P65x
      1. 3.1.1 Lock-step Compare Module (LCM)
      2. 3.1.2 Expanded Analog Channels
      3. 3.1.3 Firmware Update (FWU)
      4. 3.1.4 Flexible GPIO and Digital Input Pins
      5. 3.1.5 ADC Hardware Redundancy Safety Checker
      6. 3.1.6 Flexible Memory Sharing between CPU Subsystems
      7. 3.1.7 Increased RAM Program Memory on CLA
    2. 3.2 Communication Module Changes
    3. 3.3 Control Module Changes
    4. 3.4 Analog Module Differences
    5. 3.5 Other Device Changes
      1. 3.5.1 PIE Channel Mapping
        1. 3.5.1.1 F2837x vs F28P65x PIE Channel Mapping Comparison
      2. 3.5.2 Bootrom
      3. 3.5.3 AGPIO Filter
    6. 3.6 Power Management
      1. 3.6.1 VREGENZ
      2. 3.6.2 POR/BOR
      3. 3.6.3 Power Consumption
    7. 3.7 Memory Module Changes
    8. 3.8 GPIO Multiplexing Changes
      1. 3.8.1 F2837x vs F28P65x GPIO Mux Comparison
    9. 3.9 Analog Multiplexing Changes
      1. 3.9.1 F2837x_176PTP vs F28P65x_176PTP Analog Connections Comparison
  7. 4Application Code Migration From F2837x to F28P65x
    1. 4.1 C2000Ware Header Files
    2. 4.2 Linker Command Files
    3. 4.3 C2000Ware Examples
  8. 5EABI Support
    1. 5.1 NoINIT Struct Fix (Linker Command)
    2. 5.2 Pre-Compiled Libraries
  9.   References

3.2 Communication Module Changes

Communication module changes between the F2837x and F28P65x devices affect the number of modules. Module functionality is maintained for both devices. Table 3-1 shows the module instances and differences which should be considered when migrating applications between F2837x and F28P65x.

Table 3-1 Communication Module Instances
Module Category F2837x F28P65x Notes
SCI Number 4 - SCIA, SCIB, SCIC, SCID 2 - SCIA, SCIB
I2C Number 2 - I2CA, I2CB 2 - I2CA, I2CB
LIN Number not present 2 - LINA, LINB
CAN Number 2 - CANA, CANB 1 - CANA
CAN-FD Number not present 1 - MCANA
McBSP Number 2 -MCBSPA, MCBSPB not present
SPI Number 4 - SPIA, SPIB, SPIC, SPID 4 - SPIA, SPIB, SPIC, SPID
EMIF Number 2 - EMIF1, EMIF2 1 - EMIF1
USB Number 1 - USBA 1 - USBA
uPP Number 1 - uPP not present
FSI Number not present 4 - FSIRXA..D,2 - FSITXA, FSITXB