SPRUJ12F August   2021  – January 2024 AM2431 , AM2432 , AM2434

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Preface: Read This First
    1. 1.1 If You Need Assistance
    2. 1.2 Important Usage Notes
  5. 2Kit Overview
    1. 2.1 Kit Contents
    2. 2.2 Key Features
    3. 2.3 Component Identification
    4. 2.4 BoosterPacks
    5. 2.5 Compliance
    6. 2.6 Security
  6. 3Board Setup
    1. 3.1 Power Requirements
      1. 3.1.1 Power Input Using USB Type-C Connector
      2. 3.1.2 Power Status LED's
      3. 3.1.3 Power Tree
      4. 3.1.4 Power Sequence
    2. 3.2 Push Buttons
    3. 3.3 Boot Mode Selection
  7. 4Hardware Description
    1. 4.1  Functional Block Diagram
    2. 4.2  BoosterPack Headers
      1. 4.2.1 Pinmux for BoosterPack
    3. 4.3  GPIO Mapping
    4. 4.4  Reset
    5. 4.5  Clock
    6. 4.6  Memory Interface
      1. 4.6.1 QSPI Interface
      2. 4.6.2 Board ID EEPROM
    7. 4.7  Ethernet Interface
      1. 4.7.1 Ethernet PHY Strapping
      2. 4.7.2 Ethernet PHY - Power, Clock, Reset, Interrupt
      3. 4.7.3 LED indication in Ethernet RJ45 Connector
    8. 4.8  USB 2.0 Interface
    9. 4.9  I2C Interface
    10. 4.10 Industrial Application LEDs
    11. 4.11 UART Interface
    12. 4.12 eQEP Interface
    13. 4.13 CAN Interface
    14. 4.14 FSI Interface
    15. 4.15 JTAG Emulation
    16. 4.16 Test Automation Interface
    17. 4.17 SPI Interface
  8. 5References
    1. 5.1 Reference Documents
    2. 5.2 Other TI Components Used in This Design
  9.   A E3 Design Changes
  10.   B Revision A Design Changes
  11.   Revision History

Key Features

The AM243x LaunchPad has the following features:

  • AM2434 (ALX) MCU
  • PCB dimensions: 7.7 inch (195.58 mm) x 2.3 inch (58.42 mm)
  • Powered through 5 V, 3A USB type-C input
  • Two RJ45 Ethernet ports capable of 1Gb or 100Mb speeds
  • On-board XDS110 debug probe
  • Four push buttons:
    • PORz Reset
    • MCU warm reset
    • SoC warm reset
    • User interrupt
  • LED indicators for:
    • Power status
    • User testing
    • Ethernet connection
    • Industrial application
  • CAN connectivity with on-board CAN transceiver
  • Two independent Enhanced Quadrature Encoder Pulse (QEP)-based encoder connectors
  • Separate FSI connector
  • Two independent BoosterPack XL (40 pin) standard connectors featuring stackable headers to maximize expansion through the BoosterPack ecosystem
  • Test automation header
  • On-Board Memory:
    • 512 Mb QSPI flash
    • 1 Mb I2C EEPROM