The DRA829 and TDA4VM SoCs are part
of the K3 Multicore SoC architecture platform. The SoCs are
targeted for automotive applications and aim to meet the complex processing
needs of modern embedded products. They are designed as a low power, high performance and
highly integrated device architecture, providing significant levels of
processing power, graphics capability, video and imaging processing,
virtualization, and coherent memory support. In addition, these SoCs support
state of the art security and functional safety features.
Key distinguishing device
features:
- 64-bit architecture with
virtualization and coherent memory support, which leverages full
processing capability of 64-bit Arm® Cortex® -A72
- Fully programmable industrial
communication subsystems to enable future-proof designs for customers
that need to adopt the new Gigabit Time-sensitive Networks (TSN)
standards, but still need full support on legacy protocols and
continuous system optimization over the product deployment
- Integration of vision
hardware processing accelerators to facilitate extensive processing
requirements in low power budget for automotive ADAS and machine vision
applications
- Integration of a general-purpose
microcontroller unit (MCU) with a dual Arm® Cortex®-R5F MCU subsystem,
available for general purpose use as two cores or in lockstep, intended
to help customers achieve functional safety goals for their end
products
- Integration of a next-generation fixed and
floating-point C71x Digital Signal Processor (DSP) that
significantly boosts
power over a broad range of general signal processing tasks for both
general applications and automotive functions which also incorporates advanced techniques
to improve control code efficiency and ease of programming such as
branch prediction, protected pipeline, precise exception and virtual
memory management
- Tightly
coupled Matrix Multiplication Accelerator (MMA) that extends the C71x DSP
architecture's scalar and vector facilities enabling deep learning and
enhance vision, analytics and wide range of general applications. The
achieved total TOPS (Tera Operations Per Second) performance
significantly differentiates the device for single board computer in
machine vision and deep learning applications
- Key display features
including flexibility to interface with different panel types (eDP, DSI,
DPI) with multi-layer hardware composition
- Integration of hardware
features that help applications to achieve functional safety
mechanisms
- Robust security
architecture with sandboxed Security Controller managing all secure
configurations with high performance client-server messaging scheme
between secure Security Controller and all cores
- Simplified solution for
power supply management, enabling lower cost system solution (on-die
bias LDOs and power good comparators for minimal power sequencing
requirements consistent with low cost supply design)
Processor cores:
- Two C7x floating point,
vector DSP, up to 1.0 GHz, 160 GFLOPS, 512 GOPS
- Deep-learning matrix multiply
accelerator (MMA), up to 8 TOPS (8b) at 1.0 GHz
- Vision Processing
Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision
assist accelerators
- Depth and Motion Processing
Accelerators (DMPAC)
- Dual 64-bit Arm®Cortex®-A72 microprocessor subsystem at up to 2 GHz
- 1MB shared L2 cache
per dual-core Cortex®-A72 cluster
- 32KB L1 DCache and
48KB L1 ICache per Cortex®-A72 core
- Up to six Arm®Cortex®-R5F MCUs at up to 1.0 GHz
- 16K I-Cache, 16K
D-Cache, 64K L2 TCM
- Two Arm®Cortex®-R5F MCUs in isolated MCU subsystem
- Four (TDA4VE) or Two
(TDA4AL/TDA4VL) Arm®Cortex®-R5F MCUs in general compute
partition
- GPU IMG BXS-64-4, 256kB
Cache, up to 800 MHz, 50 GFLOPS, 4 GTexels/s (TDA4VE and TDA4VL)
- Custom-designed interconnect
fabric supporting near max processing entitlement
Memory subsystem:
- Up to 4MB of on-chip L3 RAM
with ECC and coherency
- ECC error
protection
- Shared coherent
cache
- Supports internal DMA
engine
- Up to Two External Memory
Interface (EMIF) modules with ECC
- Supports LPDDR4
memory types
- Supports speeds up to
4266 MT/s
- Two (TDA4VE) or One
(TDA4AL/TDA4VL) 32-bit data bus with inline ECC up to 17 GB/s per
EMIF
- General-Purpose Memory
Controller (GPMC)
- One (TDA4AL/TDA4VL) or Two
(TDA4VE) 12KB on-chip SRAM in MAIN domain, protected by ECC
Functional Safety:
- Functional Safety-Compliant targeted (on select
part numbers)
- Developed for functional
safety applications
- Documentation available to
aid ISO 26262 functional safety system design up to ASIL-D/SIL-3
targeted
- Systematic capability up to
ASIL-D/SIL-3 targeted
- Hardware integrity up to
ASIL-D/SIL-3 targeted for MCU Domain
- Hardware integrity up to
ASIL-B/SIL-2 targeted for Main Domain
- Safety-related
certification
Device security (on select part
numbers):
- Secure boot with secure
runtime support
- Customer programmable root
key, up to RSA-4K or ECC-512
- Embedded hardware security
module
- Crypto hardware accelerators
– PKA with ECC, AES, SHA, RNG, DES and 3DES
High speed serial
interfaces:
- One PCI-Express® (PCIe) Gen3 controllers
- Up to four lanes per
controller
- Gen1 (2.5GT/s), Gen2
(5.0GT/s), and Gen3 (8.0GT/s) operation with auto-negotiation
- One USB 3.0 dual-role device
(DRD) subsystem
- Enhanced SuperSpeed
Gen1 Port
- Supports Type-C
switching
- Independently
configurable as USB host, USB peripheral, or USB DRD
- Two CSI2.0 4L RX plus Two
CSI2.04L TX
Ethernet
- Two RGMII/RMII interfaces
Automotive interfaces:
- Twenty Modular Controller
Area Network (MCAN) modules with full CAN-FD support
Display subsystem:
- One (TDA4AL/TDA4VL) or Two
(TDA4VE) DSI 4L TX (up to 2.5K)
- One eDP 4L
(TDA4VE/TDA4VL)
- One DPI
Audio interfaces:
- Five Multichannel Audio
Serial Port (MCASP) modules
Video
acceleration:
- TDA4VE: H.264/H.265 Encode/Decode
(up to 480 MP/s)
- TDA4AL: H.264/H.265 Encode
only (up to 480 MP/s)
- TDA4VL: H.264/H.265 Encode/Decode
(up to 240 MP/s)
Flash memory
interfaces:
- Embedded MultiMediaCard
Interface ( eMMC™ 5.1)
- One Secure Digital®
3.0/Secure Digital Input Output 3.0 interfaces (SD3.0/SDIO3.0)
- Two simultaneous flash
interfaces configured as
- One OSPI or HyperBus™
or QSPI, and
- One QSPI
System-on-Chip (SoC) architecture:
- 16-nm FinFET technology
- 23 mm x 23 mm, 0.8-mm pitch, 770-pin
FCBGA (ALZ)
Companion Power
Management ICs (PMIC):
- Functional Safety-Compliant support up to ASIL-D / SIL-3 targeted
- Flexible mapping to support different use cases