SPRUJ28E November 2021 – September 2024 AM68 , AM68A , TDA4AL-Q1 , TDA4VE-Q1 , TDA4VL-Q1
This chapter introduces the features, subsystems, and architecture of the J721S2 Processor Platform high-performance System-on-Chip (SoC).
This document describes the Superset architecture, processors and peripherals of the J721S2 Family of SoCs, which are part of the K3 Multicore SoC architecture platform. Not all features are available on each family of devices. The superset J721S2 devices are available for preproduction software development. Software should constrain the features used to match the intended production device. For more information on the specific features, processors and peripherals available on a particular device, refer to the Device Comparison table in the corresponding device-specific Data sheet.
The J721S2 Processor Platforms are hereinafter commonly referred to as J721S2 platform, device, or SoC.
TI limits support for this family of SoCs to features that are supported via Software Development Kits (SDK). The SDK “build sheet” is available for download as part of each SDK and should be referenced to understand the subset of SoC hardware functionality that is available in software:
https://www.ti.com/tool/PROCESSOR-SDK-J721S2
https://www.ti.com/tool/PROCESSOR-SDK-AM68A
This document describes the Superset features of the Modules integrated into this Device. See the Module Integration section of this document for a list of module features not supported by the integration on this Device.